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Microwave Design Engineer - Passive Components and On-Chip/In-Package Antenna for Millimeter-Wa[...]

JR Italy

Lodi

In loco

EUR 45.000 - 75.000

Tempo pieno

14 giorni fa

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Descrizione del lavoro

An innovative research foundation is seeking a Microwave Design Engineer to lead the development of advanced passive components and integrated antennas for cutting-edge millimeter-wave applications. This role involves conducting research, designing and simulating antennas, and collaborating with multidisciplinary teams to ensure optimal system performance. The ideal candidate will possess a strong background in electromagnetic design and a passion for innovation. Join a dynamic environment that fosters professional growth and offers opportunities to contribute to groundbreaking projects in the semiconductor field.

Servizi

Lunch tickets
Private health care coverage
Structured growth path
Networking opportunities
International environment
Tax deductions for scientific research

Competenze

  • Master or PhD in electrical or electronic engineering with a focus on RF/mmWave.
  • Experience in designing antennas and passive components.

Mansioni

  • Conduct R&D on passive components and antennas for RF circuits.
  • Design and simulate antennas and waveguides for millimeter-wave applications.

Conoscenze

Electromagnetic Design
RF Circuit Design
Problem-Solving
Analytical Skills
Communication Skills

Formazione

Master in Electrical Engineering
PhD in Electronic Engineering

Strumenti

Ansys HFSS
CST Studio
Sonnet
ADS Momentum

Descrizione del lavoro

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Microwave Design Engineer - Passive Components and On-Chip/In-Package Antenna for Millimeter-Wave Applications, lodi

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Other

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EU work permit required:

Yes

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Job Reference:

584555200999797555233712

Job Views:

2

Posted:

26.04.2025

Expiry Date:

10.06.2025

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Job Description:

Role

The Chips-IT Foundation seeks a Microwave Design Engineer researcher to develop advanced passive components and integrated antennas for millimeter-wave applications. Focus areas include on-chip and in-package antennas, waveguides, couplers, and launchers for compact, scalable phased-array transceivers. The work spans CMOS, SiGe BiCMOS, hybrid, and 3D integration technologies, targeting next-gen 5G/6G networks, wireless sensors, and radar systems.

Key Responsibilities:

  • Conduct research and development on passive components and printed/integrated antennas for RF and millimeter-wave circuits.
  • Design and simulate on-chip and in-package antennas, waveguides, splitters, couplers, and launchers at the sub-millimeter scale for chip, package, or PCB-level implementations.
  • Develop electromagnetic models and optimize designs using EM simulation tools.
  • Perform electromagnetic modeling of chip, package, and transitions to ensure efficient integration and optimal system-level performance.
  • Collaborate with cross-functional teams for the integration of antennas and passive components into RFICs systems and advanced modules.
  • Experimentally validate the designed solutions through measurements in anechoic chambers and chip/package-level testing.
  • Supervise Master’s and PhD students, providing guidance on research projects and development in electromagnetic design.
  • Contribute to intellectual property protection through patents and publications in leading journals and conferences.
  • Stay updated on emerging trends in antenna and passive component design for RF and mmWave integrated circuits.

Required Qualifications:

  • Master or PhD in electrical or electronic engineering or a related field, with a focus on electromagnetic design for RF/mmWave components.
  • Experience in designing on-chip or in-package antennas, passive components, and electromagnetic simulations.
  • Proficiency in CAD tools for EM simulations (Ansys HFSS, CST Studio, Sonnet, ADS Momentum).
  • Expertise in antenna and passive component measurement using high-frequency instrumentation (network and spectrum analyzers, anechoic chambers).
  • Familiarity with advanced silicon integration technologies is desirable (CMOS, SiGe BiCMOS, advanced packaging, AiP/AoC antennas).
  • Strong analytical and communication skills, with an aptitude for solving complex problems in team working.
  • Determination in pursuing innovative solutions and developing new technologies.
  • Leadership skills and ability to adapt working in multidisciplinary teams.

What we offer

  • Competitive compensation and contract type, to be negotiated based on qualifications and experience
  • Lunch tickets
  • Private health care coverage depending on your role and contract
  • Structured growth path, with ongoing access to training and updates
  • Networking opportunities with industry-leading professionals
  • International environment
  • Tax deductions: Candidates from abroad, comprising Italian citizens, who have carried scientific research activity abroad and meet specific requirements, may be entitled to a taxable income deduction up to 90% for a period of 6 to 13 years

The Foundation “Italian Center for the Design of Semiconductor Integrated Circuits,” also known as the Chips-IT Foundation, is a nonprofit research and technology organization under the supervision of the Ministries of Industry.

The Foundation is Italy's first RTO (Research and Technology Organization) vertically focused on semiconductor research and stands as a center of excellence in frontier research on semiconductor design, as well as a pivotal center of the Italian semiconductor ecosystem and expertise.

Missions of the Foundation:

  • promote the design and development of integrated circuits
  • strengthen the system of professional training in the field of microelectronics
  • ensure the establishment of a network of universities, research centers and enterprises that fosters innovation and technology transfer in the field

Disclaimer

No ranking list or list of suitable candidates will be prepared and published.

The Foundation reserves the right to:

a. extend or reopen the deadline of this notice;

b. revoke this notice;

c. not make any selection from among the applications submitted if they are deemed not to meet the functions set forth in the notice;

without any claims or rights being asserted by the interested parties.

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