Advanced Packaging Engineer

JR Italy; Pisa; Remoto; EUR 45.000 - 65.000; Tempo pieno

Descrizione del lavoro

A leading innovative start-up in Pisa is seeking an Advanced Packaging Engineer to drive packaging projects and develop advanced solutions. This role involves managing a team and liaising with external partners, with remote work options available.

Competenze

• Experience in semiconductor packaging and advanced packaging solutions required.
• Strong communication and team management skills needed.

Mansioni

• Drive device packaging projects and roadmaps.
• Manage internal packaging team and package development.

Conoscenze

Strong semiconductor packaging experience

Knowledge of 2.5/3D advanced packaging solutions

Excellent communication skills

Team management abilities

Experience liaising with OSATs

Descrizione del lavoro

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Job Title: Advanced Packaging Engineer

Our innovative start-up, developing ultra-high bandwidth, low latency optical interconnects for generative AI, cellular, and high bandwidth data transfer applications, is seeking an Advanced Packaging Engineer. The role involves driving device packaging projects and roadmaps, developing 2.5/3D advanced packaging solutions, and liaising with OSATs throughout the project lifecycle, including concept exploration, design, DFM, engineering runs, development, and quality/reliability.

Managing the internal packaging team and driving overall package development within the company are key responsibilities. This position can be performed remotely.

Required Skills:

1. Strong semiconductor packaging experience and knowledge
2. Knowledge of 2.5/3D advanced packaging solutions
3. Excellent communication skills and team management abilities
4. Experience liaising with OSATs

Please contact Rachel Anderson for further details.