Advanced Packaging Engineer

IC Resources; Veneto; Remoto; EUR 50.000 - 75.000; Tempo pieno

Descrizione del lavoro

A leading technology start-up is seeking an Advanced Packaging Engineer to drive packaging projects and road-maps. Responsibilities include developing advanced packaging solutions and managing the internal packaging team. Strong semiconductor packaging experience and team management skills are essential. This role can be performed remotely from Italy.

Competenze

• Strong experience in semiconductor packaging.
• Knowledge of advanced packaging solutions.
• Proven team management skills.

Mansioni

• Drive device packaging projects and road-maps.
• Develop 2.5 / 3D advanced packaging solutions.
• Liaise with OSATs for concept-explore and design.

Conoscenze

Strong semiconductor packaging experience

2.5 / 3D advanced packaging solutions knowledge

Excellent communication and ability to manage teams

Previous experience with liaising with OSATs

Descrizione del lavoro

Our innovative new start-up developing ultra-high bandwidth, low latency optical interconnects for generative AI, cellular, and high bandwidth data transfer applications is now searching for an Advanced Packaging Engineer to drive the device packaging projects and road-maps for the company. The role will involve developing 2.5 / 3D advanced packaging solutions and liaising with OSAT's for the cycle of concept-explore, design, DFM, engineering runs, development and quality / reliability. Managing the internal packaging team will be a key part of the role as well as driving overall package development within the company. This role can worked from a remote location.

Required skills for the Advanced Packaging Engineer will include :

• Strong semiconductor packaging experience and knowledge
• 2.5 / 3D advanced packaging solutions knowledge
• Excellent communication and ability to manage teams
• Previous experience with liasing with OSAT's

Please contact Rachel Anderson for further details.

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