Advanced Packaging Engineer

IC Resources; Trieste/Trst; Remoto; EUR 50.000 - 70.000; Tempo pieno

Descrizione del lavoro

An innovative start-up in Trieste is seeking an Advanced Packaging Engineer to lead device packaging projects and develop advanced packaging solutions. The role involves collaborating with OSATs and managing an internal packaging team. The ideal candidate will have strong semiconductor packaging experience and expertise in 2.5 / 3D solutions. This position can be worked remotely.

Mansioni

• Developing 2.5 / 3D advanced packaging solutions.
• Collaborating with OSATs across the entire cycle.
• Managing the internal packaging team.
• Driving overall package development.

Conoscenze

Strong semiconductor packaging experience and knowledge

Expertise in 2.5 / 3D advanced packaging solutions

Excellent communication skills

Team management experience

Previous experience liaising with OSATs

Formazione

Degree qualification

Descrizione del lavoro

Our innovative start-up, developing ultra-high bandwidth, low latency optical interconnects for generative AI, cellular, and high bandwidth data transfer applications, is seeking an Advanced Packaging Engineer to lead device packaging projects and develop roadmaps for the company.

The role involves:

1. Developing 2.5 / 3D advanced packaging solutions
2. Collaborating with OSATs across the entire cycle: concept exploration, design, DFM, engineering runs, development, and quality/reliability
3. Managing the internal packaging team
4. Driving overall package development within the company

This position can be worked remotely.

Required skills:

• Strong semiconductor packaging experience and knowledge
• Expertise in 2.5 / 3D advanced packaging solutions
• Excellent communication skills and team management experience
• Previous experience liaising with OSATs
• Degree qualification

Please contact Rachel Anderson for further details.