Advanced Packaging Engineer

IC Resources; Torre Pedrera; Remoto; EUR 50.000 - 70.000; Tempo pieno

Descrizione del lavoro

A leading technology firm in Italy is seeking an Advanced Packaging Engineer to spearhead device packaging projects. This role involves developing cutting-edge 2.5 / 3D packaging solutions and collaborating with OSAT's while managing a dynamic internal team. The ideal candidate must have strong experience in semiconductor packaging and excellent communication skills, and can work remotely.

Competenze

• Experience in semiconductor packaging.
• Knowledge of advanced packaging solutions.
• Proven team management ability.

Mansioni

• Drive device packaging projects and road-maps.
• Develop 2.5 / 3D advanced packaging solutions.
• Liaise with OSAT's for project cycles.

Conoscenze

Strong semiconductor packaging experience

Knowledge of 2.5 / 3D advanced packaging solutions

Excellent communication

Ability to manage teams

Experience with liaising with OSAT's

Formazione

Degree qualified

Descrizione del lavoro

Our innovative new start-up developing ultra-high bandwidth, low latency optical interconnects for generative AI, cellular, and high bandwidth data transfer applications is now searching for an Advanced Packaging Engineer to drive the device packaging projects and road-maps for the company. The role will involve developing 2.5 / 3D advanced packaging solutions and liaising with OSAT's for the cycle of concept-explore, design, DFM, engineering runs, development and quality / reliability. Managing the internal packaging team will be a key part of the role as well as driving overall package development within the company. This role can worked from a remote location.

Required skills for the Advanced Packaging Engineer will include :

• Strong semiconductor packaging experience and knowledge
• 2.5 / 3D advanced packaging solutions knowledge
• Excellent communication and ability to manage teams
• Previous experience with liasing with OSAT's
• Degree qualified

Please contact Rachel Anderson for further details.

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