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A dynamic tech start-up in Campania is seeking an Advanced Packaging Engineer to lead device packaging projects and develop advanced packaging solutions. The role includes managing a team and coordinating with external partners. Candidates should possess strong semiconductor packaging experience and excellent communication skills. This position offers the flexibility to work remotely.
Our innovative start-up, developing ultra-high bandwidth, low latency optical interconnects for generative AI, cellular, and high bandwidth data transfer applications, is seeking an Advanced Packaging Engineer to lead device packaging projects and roadmaps.
The role involves developing 2.5 / 3D advanced packaging solutions and liaising with OSATs throughout the cycle of concept exploration, design, DFM, engineering runs, development, and quality/reliability assurance.
Managing the internal packaging team and driving overall package development within the company are key responsibilities. This position can be worked remotely.
Please contact Rachel Anderson for further details.