Advanced Packaging Engineer

IC Resources; Ravenna; Remoto; EUR 50.000 - 70.000; Tempo pieno

Descrizione del lavoro

An innovative start-up located in Italy is seeking an Advanced Packaging Engineer to lead the development of 2.5 / 3D advanced packaging solutions, manage the internal packaging team, and liaise with OSATs. The candidate must have strong experience in semiconductor packaging and excellent communication skills. This position offers the flexibility to work remotely.

Mansioni

• Developing 2.5 / 3D advanced packaging solutions.
• Liaising with OSATs throughout the packaging cycle.
• Managing the internal packaging team.
• Driving overall package development within the company.

Conoscenze

Strong semiconductor packaging experience and knowledge

Expertise in 2.5 / 3D advanced packaging solutions

Excellent communication skills

Team management abilities

Previous experience liaising with OSATs

Formazione

Degree qualification

Descrizione del lavoro

Our innovative start-up, developing ultra-high bandwidth, low latency optical interconnects for generative AI, cellular, and high bandwidth data transfer applications, is seeking an Advanced Packaging Engineer to lead device packaging projects and roadmaps.

The role involves:

1. Developing 2.5 / 3D advanced packaging solutions
2. Liaising with OSATs throughout the cycle of concept, explore, design, DFM, engineering runs, development, and quality/reliability
3. Managing the internal packaging team
4. Driving overall package development within the company

This position can be worked remotely.

Required skills:

• Strong semiconductor packaging experience and knowledge
• Expertise in 2.5 / 3D advanced packaging solutions
• Excellent communication skills and team management abilities
• Previous experience liaising with OSATs
• Degree qualification

Please contact Rachel Anderson for further details.