Advanced Packaging Engineer

IC Resources; Pisa; In loco; EUR 40.000 - 70.000; Tempo pieno

Descrizione del lavoro

A dynamic start-up is seeking an Advanced Packaging Engineer to spearhead innovative packaging solutions for high bandwidth applications. The ideal candidate will manage packaging projects, oversee team dynamics, and ensure collaboration with OSAT partners. This role offers the flexibility to work remotely, catering to candidates with strong experience in semiconductor packaging and team management.

Mansioni

• Drive device packaging projects and road-maps.
• Manage the internal packaging team.
• Liaise with OSAT's for various development phases.

Conoscenze

Semiconductor packaging

2.5 / 3D advanced packaging solutions

Team management

Communication skills

Descrizione del lavoro

Our innovative new start-up developing ultra-high bandwidth, low latency optical interconnects for generative AI, cellular, and high bandwidth data transfer applications is now searching for an Advanced Packaging Engineer to drive the device packaging projects and road-maps for the company. The role will involve developing 2.5 / 3D advanced packaging solutions and liaising with OSAT's for the cycle of concept-explore, design, DFM, engineering runs, development and quality / reliability. Managing the internal packaging team will be a key part of the role as well as driving overall package development within the company. This role can worked from a remote location.

Required skills for the Advanced Packaging Engineer will include :

• Strong semiconductor packaging experience and knowledge
• 2.5 / 3D advanced packaging solutions knowledge
• Excellent communication and ability to manage teams
• Previous experience with liasing with OSAT's

Please contact Rachel Anderson for further details.

Engineer Packaging • Pisa, Tuscany, Italy