Advanced Packaging Engineer

JR Italy; Lodi; In loco; EUR 50.000 - 70.000; Tempo pieno

Descrizione del lavoro

An innovative tech start-up in Italy is seeking an Advanced Packaging Engineer to lead device packaging projects and collaborate on 2.5/3D advanced packaging solutions. This role requires strong semiconductor packaging experience and a degree qualification. Excellent communication and team management skills are essential. The position also allows for remote work.

Competenze

• Strong semiconductor packaging experience required.
• Expertise in 2.5/3D advanced packaging solutions essential.
• Proven track record in team management.

Mansioni

• Lead device packaging projects and roadmaps.
• Collaborate with OSATs throughout the development cycle.

Conoscenze

Strong semiconductor packaging experience

Expertise in 2.5/3D advanced packaging solutions

Excellent communication skills

Team management abilities

Experience liaising with OSATs

Formazione

Degree qualification

Descrizione del lavoro

Our innovative start-up, developing ultra-high bandwidth, low latency optical interconnects for generative AI, cellular, and high bandwidth data transfer applications, is seeking an Advanced Packaging Engineer to lead device packaging projects and roadmaps.

The role involves developing 2.5/3D advanced packaging solutions and collaborating with OSATs throughout the cycle of concept exploration, design, DFM, engineering runs, development, and quality/reliability. Managing the internal packaging team and driving overall package development within the company are key responsibilities.

This position can be worked remotely.

Required skills:

1. Strong semiconductor packaging experience and knowledge
2. Expertise in 2.5/3D advanced packaging solutions
3. Excellent communication skills and team management abilities
4. Experience liaising with OSATs
5. Degree qualification

Please contact Rachel Anderson for further details.