Advanced Packaging Engineer

IC Resources; Firenze; Remoto; EUR 50.000 - 70.000; Tempo pieno

Descrizione del lavoro

A leading tech start-up in Tuscany is looking for an Advanced Packaging Engineer to lead projects in device packaging. The role involves developing advanced packaging solutions and managing the internal team while collaborating with partners. Strong semiconductor experience and degree qualification are required. This position offers remote working options.

Mansioni

• Developing 2.5 / 3D advanced packaging solutions.
• Collaborating with OSATs through the development cycle.
• Managing the internal packaging team.
• Driving overall package development within the company.

Conoscenze

Strong semiconductor packaging experience and knowledge

Expertise in 2.5 / 3D advanced packaging solutions

Excellent communication skills and team management abilities

Previous experience liaising with OSATs

Formazione

Degree qualification

Descrizione del lavoro

Our innovative start-up is developing ultra-high bandwidth, low latency optical interconnects for generative AI, cellular, and high bandwidth data transfer applications. We are seeking an Advanced Packaging Engineer to lead device packaging projects and roadmaps for the company.

The role involves:

1. Developing 2.5 / 3D advanced packaging solutions
2. Collaborating with OSATs throughout the cycle of concept, exploration, design, DFM, engineering runs, development, and quality/reliability
3. Managing the internal packaging team
4. Driving overall package development within the company

This position can be worked remotely.

Required skills:

• Strong semiconductor packaging experience and knowledge
• Expertise in 2.5 / 3D advanced packaging solutions
• Excellent communication skills and team management abilities
• Previous experience liaising with OSATs
• Degree qualification

Please contact Rachel Anderson for further details.