Advanced Packaging Engineer

JR Italy; Ferrara; In loco; EUR 45.000 - 65.000; Tempo pieno

Descrizione del lavoro

A leading technology startup in Ferrara is seeking an Advanced Packaging Engineer to lead device packaging projects for advanced solutions. The role requires strong semiconductor packaging experience and expertise in 2.5/3D solutions. The successful candidate will manage an internal team and collaborate with OSATs. This position offers the possibility to work remotely.

Mansioni

• Lead device packaging projects and roadmaps.
• Develop 2.5/3D advanced packaging solutions.
• Collaborate with OSATs throughout development.
• Manage internal packaging team and package development.

Conoscenze

Strong semiconductor packaging experience

Expertise in 2.5/3D advanced packaging solutions

Excellent communication skills

Team management abilities

Experience liaising with OSATs

Formazione

Degree qualification

Descrizione del lavoro

Our innovative start-up, developing ultra-high bandwidth, low latency optical interconnects for generative AI, cellular, and high bandwidth data transfer applications, is seeking an Advanced Packaging Engineer to lead device packaging projects and roadmaps.

The role involves developing 2.5/3D advanced packaging solutions and collaborating with OSATs throughout the cycle of concept exploration, design, DFM, engineering runs, development, and quality/reliability. Managing the internal packaging team and driving overall package development within the company are key responsibilities.

This position can be worked remotely.

Required skills:

1. Strong semiconductor packaging experience and knowledge
2. Expertise in 2.5/3D advanced packaging solutions
3. Excellent communication skills and team management abilities
4. Experience liaising with OSATs
5. Degree qualification

Please contact Rachel Anderson for further details.