Advanced Packaging Engineer

IC Resources; Cuneo; Remoto; EUR 45.000 - 65.000; Tempo pieno

Descrizione del lavoro

A cutting-edge technology start-up is looking for an Advanced Packaging Engineer to lead packaging projects and drive development. The role requires strong expertise in semiconductor packaging, excellent communication, and team management skills. Candidates will be involved in developing advanced packaging solutions and collaborating with OSATs. This position offers a remote work option.

Mansioni

• Developing 2.5 / 3D advanced packaging solutions.
• Liaising with OSATs for concept exploration, design, and development.
• Managing the internal packaging team.
• Driving overall package development within the company.

Conoscenze

Strong semiconductor packaging experience

Expertise in 2.5 / 3D advanced packaging solutions

Excellent communication skills

Team management experience

Previous experience liaising with OSATs

Formazione

Degree qualification

Descrizione del lavoro

Our innovative start-up, developing ultra-high bandwidth, low latency optical interconnects for generative AI, cellular, and high bandwidth data transfer applications, is seeking an Advanced Packaging Engineer to lead device packaging projects and roadmaps.

The role involves:

1. Developing 2.5 / 3D advanced packaging solutions
2. Liaising with OSATs for concept exploration, design, DFM, engineering runs, development, and quality/reliability
3. Managing the internal packaging team
4. Driving overall package development within the company

This position can be worked remotely.

Requirements:

• Strong semiconductor packaging experience and knowledge
• Expertise in 2.5 / 3D advanced packaging solutions
• Excellent communication skills and team management experience
• Previous experience liaising with OSATs
• Degree qualification

Please contact Rachel Anderson for further details.