Advanced Packaging Engineer

IC Resources; Como; Remoto; EUR 50.000 - 70.000; Tempo pieno

Descrizione del lavoro

A cutting-edge startup in Lombardia, Italy is looking for an Advanced Packaging Engineer to lead device packaging projects and manage the internal team. This role requires strong knowledge in semiconductor packaging and the ability to liaise with OSATs. Excellent communication skills and a degree qualification are essential. The position allows for remote work, making it flexible for candidates.

Competenze

• Strong semiconductor packaging experience and knowledge.
• Expertise in 2.5 / 3D advanced packaging solutions.
• Excellent communication and team management skills.
• Experience liaising with OSATs.

Mansioni

• Drive device packaging projects and roadmaps for the company.
• Develop 2.5 / 3D advanced packaging solutions.
• Liaise with OSATs during design and development.
• Manage the internal packaging team.

Conoscenze

Semiconductor packaging experience

Knowledge of 2.5 / 3D advanced packaging solutions

Excellent communication

Team management ability

Experience with OSATs

Formazione

Degree qualification

Descrizione del lavoro

Overview

Our innovative new start-up developing ultra-high bandwidth, low latency optical interconnects for generative AI, cellular, and high bandwidth data transfer applications is now searching for an Advanced Packaging Engineer to drive the device packaging projects and road-maps for the company. The role will involve developing 2.5 / 3D advanced packaging solutions and liaising with OSAT's for the cycle of concept-explore, design, DFM, engineering runs, development and quality / reliability. Managing the internal packaging team will be a key part of the role as well as driving overall package development within the company. This role can worked from a remote location.

Responsibilities

• Drive device packaging projects and roadmaps for the company.
• Develop 2.5 / 3D advanced packaging solutions.
• Liaise with OSATs through concept exploration, design, DFM, engineering runs, development, and quality/reliability.
• Manage the internal packaging team and drive overall package development within the company.
• Support remote work arrangement as applicable.

Qualifications

• Strong semiconductor packaging experience and knowledge.
• 2.5 / 3D advanced packaging solutions knowledge.
• Excellent communication and ability to manage teams.
• Previous experience liaising with OSATs.
• Degree qualified.

Contact

Please contact Rachel Anderson for further details.