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An innovative start-up in Campania, Italy, seeks an Advanced Packaging Engineer to lead device packaging projects and develop 2.5/3D solutions. The ideal candidate will have strong semiconductor packaging experience and expertise in collaborating with OSATs. This role offers remote working options and is an excellent opportunity for a motivated engineer looking to impact generative AI and high bandwidth applications.
Our innovative start-up, developing ultra-high bandwidth, low latency optical interconnects for generative AI, cellular, and high bandwidth data transfer applications, is seeking an Advanced Packaging Engineer to lead device packaging projects and roadmaps.
The role involves developing 2.5/3D advanced packaging solutions and collaborating with OSATs throughout the cycle of concept exploration, design, DFM, engineering runs, development, and quality/reliability. Managing the internal packaging team and driving overall package development within the company are key responsibilities.
This position can be worked remotely.
Please contact Rachel Anderson for further details.