Advanced Packaging Engineer

IC Resources; Ancona; Remoto; EUR 50.000 - 70.000; Tempo pieno

Descrizione del lavoro

A start-up in optical interconnects based in Italy is seeking an Advanced Packaging Engineer to drive device packaging projects and develop advanced packaging solutions. The position involves liaison with OSATs and management of the internal team. Strong semiconductor packaging experience and a degree are required. This role can be worked from a remote location.

Mansioni

• Drive device packaging projects and roadmaps for the company.
• Develop 2.5 / 3D advanced packaging solutions.
• Liaise with OSATs through the cycle of concept-explore, design, DFM, engineering runs, development and quality / reliability.
• Manage the internal packaging team and drive overall package development.

Conoscenze

Strong semiconductor packaging experience

2.5 / 3D advanced packaging solutions knowledge

Excellent communication

Ability to manage teams

Previous experience with liaising with OSATs

Formazione

Degree qualified

Descrizione del lavoro

Overview

Our innovative new start-up developing ultra-high bandwidth, low latency optical interconnects for generative AI, cellular, and high bandwidth data transfer applications is now searching for an Advanced Packaging Engineer to drive the device packaging projects and roadmaps for the company. The role will involve developing 2.5 / 3D advanced packaging solutions and liaising with OSATs for the cycle of concept-explore, design, DFM, engineering runs, development and quality / reliability. Managing the internal packaging team will be a key part of the role as well as driving overall package development within the company. This role can worked from a remote location. Please contact Rachel Anderson for further details.

Responsibilities

• Drive device packaging projects and roadmaps for the company.
• Develop 2.5 / 3D advanced packaging solutions.
• Liaise with OSATs through the cycle of concept-explore, design, DFM, engineering runs, development and quality / reliability.
• Manage the internal packaging team and drive overall package development within the company.

Qualifications

• Strong semiconductor packaging experience and knowledge
• 2.5 / 3D advanced packaging solutions knowledge
• Excellent communication and ability to manage teams
• Previous experience with liaising with OSATs
• Degree qualified