Advanced Packaging Engineer

IC Resources; Ancona; Remoto; EUR 60.000 - 90.000; Tempo pieno

Descrizione del lavoro

An innovative technology start-up is seeking an Advanced Packaging Engineer to lead projects in device packaging and develop 2.5 / 3D advanced packaging solutions. This role involves managing an internal team and liaising with OSATs. Strong experience in semiconductor packaging and excellent communication skills are required. The position offers flexibility to work remotely.

Mansioni

• Drive device packaging projects and road-maps.
• Develop 2.5 / 3D advanced packaging solutions.
• Manage the internal packaging team and overall package development.

Conoscenze

Strong semiconductor packaging experience

2.5 / 3D advanced packaging solutions knowledge

Excellent communication and ability to manage teams

Previous experience with liaising with OSAT's

Degree qualified

Descrizione del lavoro

Our innovative new start-up developing ultra-high bandwidth, low latency optical interconnects for generative AI, cellular, and high bandwidth data transfer applications is now searching for an Advanced Packaging Engineer to drive the device packaging projects and road-maps for the company. The role will involve developing 2.5 / 3D advanced packaging solutions and liaising with OSAT's for the cycle of concept-explore, design, DFM, engineering runs, development and quality / reliability. Managing the internal packaging team will be a key part of the role as well as driving overall package development within the company. This role can worked from a remote location.

Required skills for the Advanced Packaging Engineer will include :

• Strong semiconductor packaging experience and knowledge
• 2.5 / 3D advanced packaging solutions knowledge
• Excellent communication and ability to manage teams
• Previous experience with liasing with OSAT's
• Degree qualified

Please contact Rachel Anderson for further details.