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Cadence is seeking a Sr. Principal Product Engineer for the Digital & Signoff Group in Bangalore. In this role, you'll be the bridge between R&D and customers, influencing chip design software and solving complex design challenges at 7nm and below.
Ideal candidates will have significant experience in ASIC design, strong technical skills, and proficiency in scripting. This role offers a chance to work on impactful projects in a collaborative environment.
At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.
Sr. Principal Product Engineer – Digital & Signoff Group (DSG)
Location: Bangalore
Team: Cadence DSG (Digital & Signoff Group)
Join Cadence’s Digital and Signoff Group (DSG) as a Product Engineer, where you will act as the vital bridge between R&D, Application Engineering, and our global customers. In this high-impact role, you will influence the next generation of chip design software, helping industry leaders solve complex physical design challenges at 7nm and below.
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