SR MGR R&D/PRODUCT DVL ENGINEERING

TE Connectivity; Bengaluru; On-site; INR 1,500,000 - 2,500,000; Full time

Benefits offered by this job

Competitive salary package

Performance-based bonus plans

Health and wellness incentives

Employee stock purchase program

Job summary

TE Connectivity is seeking a Senior Manager for R&D/Product Development Engineering in Bengaluru, India. This role focuses on high-speed PCB design and involves leading teams to innovate solutions for high-performance interconnect products in AI and datacenter applications.

The ideal candidate will have extensive experience in PCB design and simulation, along with strong leadership capabilities to mentor and develop engineering teams while ensuring projects meet deadlines and performance requirements. Benefits include competitive salary and wellness incentives.

Qualifications

• 20 years of extensive hands-on experience in high-speed PCB design.
• 8-10 years of progressive leadership or management experience.
• Strong knowledge of industry standards and PCB manufacturing processes.

Responsibilities

• Lead, mentor and develop teams of high-speed PCB designers.
• Define and implement design methodologies for signal integrity.
• Collaborate closely with cross-functional teams to resolve issues.

Skills

High-speed PCB design

Signal Integrity

Project Management

Technical Documentation

Education

Bachelor's degree in electrical or electronics engineering

Master's degree preferred

Tools

Altium Designer

Ansys SIwave

Cadence Sigrity

Job description

SR MGR R&D/PRODUCT DVL ENGINEERING

Posting Start Date: 6/24/26

Job Overview

Digital Data & Networks (DDN) Business Unit in TE Connectivity, where we enable high‑speed connectivity solutions that power today’s and tomorrow’s data‑driven world. The engineering team is responsible for the development of innovative interconnect solution products used in hyperscale computers, AI, datacenters, cloud servers, and other IT systems, including connectors, cable assemblies, bus bars, and sockets. We engineer and manufacture cutting‑edge interconnect solutions that support high‑speed data transmission, signal integrity, and power efficiency.

BU / Function

The team focuses on the design of high‑performance high‑speed printed circuit boards for AI and datacenter applications, ensuring quality, performance, and manufacturability through strategic planning, technical guidance and cross‑functional collaboration.

Role Objective

Sr. Manager is a senior engineering leader for high‑speed PCB design and simulation. The role leads teams in designing, simulating, and validating high‑performance PCBs and ensures project deadlines, budget targets, and performance goals are met while driving continuous process improvement.

Responsibilities

• Lead, mentor and develop teams of high‑speed PCB designers and simulators, focusing on career growth and skill development.
• Define and implement high‑speed design and simulation roadmaps, methodologies and best practices for signal integrity, power integrity, EMC, RFI and thermal analysis.
• Collaborate closely with hardware, firmware, mechanical and manufacturing teams to translate requirements into viable designs and resolve issues.
• Oversee multiple complex PCB design and simulation projects, ensuring they meet deadlines, budget requirements and performance targets.
• Provide technical guidance on PCB layout, schematic creation, component selection and stay current with new technologies and design standards.
• Conduct design and simulation reviews, providing strategic recommendations to optimize PCB performance and reliability.
• Drive innovation and improvement in high‑speed PCB design and simulation processes, staying current with emerging technologies and simulation tools.
• Lead accuracy in design and simulations, conduct design of experiments, plausibility checks, sensitivity studies, validate simulation results with experimental data and design optimizations for first‑time‑right manufacturability.

Candidate Desired Profile

Education

• Bachelor’s degree in electrical or electronics engineering from a premier institute/university
• Master’s degree in a related field is preferred

Experience

• 20 years of extensive hands‑on experience in high‑speed PCB design and simulation with a proven track record of delivering complex projects.

Leadership

• 8–10 years of progressive leadership or management experience in leading and developing high‑performing engineering teams.
• Experience in customer engagement and stakeholder management is essential.

Technical Skills

• Deep understanding of engineering principles for high‑speed PCB design, signal integrity, power integrity, EMC, RFI and thermal analysis.
• Deep understanding of PCB layout, schematic creation, routing and manufacturability.
• Expertise in high‑speed PCB design tools such as Altium Designer, Allegro or PADS.
• Expertise in high‑speed PCB simulation tools for electrical and thermal analysis – Ansys SIwave/HFSS, Keysight Pathwave ADS, Keysight SIPro, Siemens HyperLyx, Cadence Sigrity, Dassault CST Studio Suite, Ansys EMC Plus, Cadence Microwave Office, Ansys ICEPAK/Siemens FLOTHERM/Cadence CELSIUS.
• Strong knowledge of industry standards (IPC, JEDEC, PCIe, USB, Ethernet) and PCB manufacturing processes, including design for manufacturability (DFM).

Soft Skills

• Proven inspiring leadership, team management, prioritisation, strategy and execution.
• Experience in organisational development, talent attraction, management and retention.
• Promotion of employee well‑being and work‑life balance.
• Passion for technology and scientific/engineering excellence.
• Excellent problem‑solving and analytical skills to resolve complex technical issues.
• Strong technical documentation, report preparation and presentation skills.
• Strong verbal and written communication skills to articulate complex technical concepts to both technical and non‑technical stakeholders.
• Ability to work effectively in a fast‑paced, collaborative global environment and across global time zones.
• Proficient in MS Office software (Word, Excel, PPT, Outlook, MS Teams).

What your background should look like

Generally requires a bachelor's degree with 12+ years of experience; a master’s with 10+ years; or a PhD level with 6+ years; or local equivalent.

Benefits

• Competitive salary package
• Performance‑based bonus plans
• Health and wellness incentives
• Employee stock purchase program
• Community outreach programs / charity events
• Employee resource groups

Job Locations

88P, Sahasra Shree
Bangalore, Karnataka 560066
India
Travel Required: 10% to 25%

TE Connectivity and its subsidiaries, affiliates, and operating units (collectively, the "Company") is committed to providing a work environment that prohibits discrimination on the basis of age, color, disability, ethnicity, marital status, national origin, race, religion, gender, gender identity, sexual orientation, protected veteran status, disability or any other characteristics protected by applicable law or regulation.