Senior Staff Engineer, Physical Verification

Renesaselectronics; Bengaluru; On-site; INR 2,800,000 - 5,200,000; Full time

Job summary

Renesas Electronics is seeking an experienced Physical Verification (PV) Engineer to drive signoff verification and tapeout readiness for advanced ASIC/SoC designs. You will execute and debug DRC/LVS/ERC, manage foundry-qualified rule decks, and ensure block and full-chip layouts meet manufacturing requirements before tapeout.

Collaboration with Physical Design, Layout, and Foundry teams is essential to achieve milestones.

Qualifications

• Bachelor's or Master's degree in Electronics Engineering or Electrical Engineering.
• 10–15 years of PV/Physical Verification experience.
• Proficient with DRC, LVS, ERC, Antenna, and Density checks.

Responsibilities

• Perform signoff Physical Verification for block- and chip-level designs.
• Debug verification violations and drive closure with teams.
• Maintain foundry-qualified rule decks and waivers.
• Coordinate verification re-runs after ECOs and design changes.
• Generate signoff reports, metrics, and violation summaries.
• Ensure tapeout readiness and adherence to manufacturing rules.
• Collaborate with Physical Design, Layout, Foundry/PDK, and program teams.
• Provide final signoff evidence including DRC/LVS-clean reports and waiver summaries.

Skills

Tcl scripting

Python scripting

Perl scripting

Shell scripting

Education

Bachelor's in Electronics Engineering

Master's in Electronics Engineering

Tools

Calibre

Pegasus

Job description

We are seeking an experienced Physical Verification (PV) Engineer to drive signoff verification and tapeout readiness for advanced ASIC/SoC designs. The candidate will be responsible for executing and debugging physical verification checks, driving violation closure, maintaining foundry-qualified verification flows, and ensuring block and full-chip layouts meet manufacturing requirements before tapeout.

Key Responsibilities

• Perform and drive signoff Physical Verification for block- and chip-level designs.
• Execute and analyze DRC, LVS, ERC, Antenna, and Density checks using industry-standard signoff tools.
• Debug verification violations and provide actionable recommendations to Physical Design and Layout teams.
• Drive closure of signoff issues through effective tracking, prioritization, and cross-functional collaboration.
• Maintain and support foundry-qualified rule decks, runsets, and waiver management processes.
• Manage waiver tracking and ensure compliance with foundry guidelines and project signoff requirements.
• Coordinate verification re-runs following design changes and ECOs to identify regressions and maintain signoff quality.
• Work closely with Physical Design, Layout, Foundry/PDK, and Program teams to achieve tapeout milestones.
• Generate periodic signoff status reports, metrics, and violation summaries for project reviews.
• Prepare final signoff evidence including DRC/LVS-clean reports, waiver summaries, and residual risk assessments for tapeout reviews.

Qualifications

• Bachelor's or Master's degree in Electronics Engineering or Electrical Engineering.
• 10-15 years of experience in Physical Verification, Physical Design, or Backend Implementation.
• Strong expertise in DRC, LVS, ERC, Antenna, and Density verification methodologies.
• Hands-on experience with Calibre, Pegasus, or equivalent physical verification tools.
• Good understanding of foundry signoff requirements, PDKs, and semiconductor manufacturing rules.
• Experience in debugging and resolving complex signoff violations at block and full-chip levels.
• Familiarity with GDSII/OASIS databases, netlists, and tapeout processes.
• Proficiency in Tcl, Python, Perl, or Shell scripting.

Preferred Qualifications

• Experience with advanced technology nodes (7nm, 5nm, 3nm, and below).
• Knowledge of Physical Design, PDN, STA, and implementation flows.
• Experience supporting multiple successful SoC tapeouts.
• Strong problem-solving, communication, and stakeholder management skills.

Why Join Us?

Join a high-impact team responsible for ensuring silicon manufacturability and signoff quality for next-generation SoCs. You will work closely with design, implementation, and foundry teams to drive successful tapeouts on cutting-edge process technologies.

Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier . With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world-leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.

At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

• We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.

Are you ready to join our team and shape the future with us?

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement .