Senior PCB Design Engineer

Astrome; Bengaluru; On-site; INR 2,400,000 - 4,000,000; Full time

Benefits offered by this job

Gratuity

Health Insurance

Job summary

Astrome in Bengaluru, India is seeking a Senior PCB Design Engineer to lead end-to-end layout, routing, and manufacturing file generation for high-speed, multi‑layer boards in the telecom/data storage space. You will collaborate with global manufacturing partners, manage timelines, and apply AI-assisted design workflows to optimize performance, noise control, and manufacturability.

Proficiency with Cadence OrCAD/Allegro, Siemens Xpedition, KiCAD, and DFM/DFA knowledge is required for 6+ layer

Qualifications

• 4–5 years PCB design experience in electronics.
• Experience multi-layer 6+ layer boards.
• Proficient in Cadence OrCAD/Allegro, Xpedition or KiCAD.
• Understanding of DFM/DFA for reliable fabrication.
• Strong communication with vendors (domestic and international).
• Experience applying AI tools to design workflows.

Responsibilities

• Own full PCB layout cycle from placement to Gerber/ODB++ files.
• Design high-speed, multi-layer boards (6+ layers) with strict layout practices.
• Interface with fabrication/assembly vendors to ensure seamless production.
• Plan, estimate, and manage project timelines for hardware delivery.
• Leverage AI tools to streamline design workflows and troubleshooting.
• Bridge schematic to layout with solid control/power/signal understanding.

Skills

PCB design

High-speed design

Project planning

Vendor collaboration

AI tooling in engineering

Communication

Education

Bachelor's degree in Electronics

Tools

Cadence OrCAD

Cadence Allegro

Siemens Xpedition

KiCAD

DFM/DFA knowledge

Job description

Job Description:

We are seeking a highly skilled and detail-oriented Senior PCB Design Engineer to join our hardware

development team. In this role, you will be responsible for the end-to-end design, layout, and

optimization of complex printed circuit boards for advanced electronics. The ideal candidate brings a

strong background in high-speed, multi-layer designs within sectors like telecom or data storage,

coupled with a forward-thinking approach to integrating AI tools into engineering workflows. You will

collaborate closely with cross-functional teams and manage relationships with global manufacturing

partners to bring cutting-edge hardware from concept to production.

Key Responsibilities

• Take ownership of the full PCB layout cycle, from component placement and routing to generating final manufacturing files (Gerber, ODB++, etc.).
• Design high-speed, multi-layer boards (6+ layers) ensuring optimal performance, minimal noise, and strict adherence to layout best practices.
• Interact directly with domestic and international fabrication and assembly vendors to ensure seamless manufacturing and resolve technical queries.
• Plan, estimate, and manage project timelines to ensure hardware deliverables meet tight production schedules.
• Leverage advanced AI tools and agents (e.g., Gemini, Claude) to streamline research, optimize design workflows, and troubleshoot engineering challenges.
• Bridge the gap between schematic design and physical layout by applying a solid understanding of control, power, and signal dynamics.

Essential Requirements:

1. 4 to 5 years of hands‑on experience designing PCBs in an electronics company, specifically within sectors such as telecommunications, data storage, or similar high‑tech industries.

2. Proven expertise in designing multi‑layer, high‑speed boards featuring 6 or more layers, with a strict adherence to layout best practices.

3. High proficiency in industry‑standard PCB design and EDA tools, including Cadence OrCAD, Cadence Allegro, Siemens Xpedition, and/or KiCAD.

4. Strong foundational understanding of the PCB manufacturing process (DFM/DFA) to ensure designs are optimized for reliable fabrication.

5. Solid grasp of diverse electrical circuit aspects, including Control, Power, Signal routing, and Noise mitigation.

6. Excellent verbal and written communication skills, with a demonstrated ability to effectively manage and collaborate with both domestic and international vendors.

7. Strong capability in project planning, scope assessment, and accurately estimating development timelines.

8. Practical knowledge of modern AI tools (including Claude, Gemini, AI prompting, and AI Agents) and how to apply them to improve daily productivity and engineering outputs.

Desirable Requirements:

1. A foundational understanding of, and past exposure to, Signal Integrity (SI) and Power Integrity (PI) analysis.

2. Previous experience designing Radio Frequency (RF) PCBs.

3. Active or past IPC Certification (e.g., CID/CID+) is highly preferred.

4. Prior self‑on experience with the testing, debugging, and initial bring‑up of newly fabricated PCBs.

At Astrome we provide our employees with perks like Gratuity and Health Insurance.