Senior Group Technical Architect

HCL Technologies Limited; Bengaluru; On-site; INR 3,000,000 - 6,000,000; Full time

Job summary

HCLTech seeks a Chip Lead to drive end-to-end SoC/ASIC programs for global customers, owning delivery, customer engagement, and technical leadership. The role combines deep VLSI expertise with strong program management and business-facing responsibilities.

The candidate will lead cross-functional teams across RTL Design, Verification, Physical Design, and DFT, ensuring on-time tapeouts and strong stakeholder engagement. 12–16 years of VLSI/SoC experience is preferred.

Qualifications

• 12-16 years in VLSI/SoC development.
• Proven experience leading customer-facing chip programs.
• Strong knowledge of SoC architecture and integration.
• RTL to GDSII full flow experience.
• Verification methodologies (UVM).
• Physical design and signoff; tapeouts in multiple wins.
• Strong stakeholder management (customer + internal).

Responsibilities

• Own end-to-end chip program delivery for customer engagements (architecture to silicon bring-up).
• Act as primary technical interface to customers, driving trust, reviews, and escalations.
• Lead cross-functional teams across RTL Design and Verification (UVM-based).
• Physical Design (PnR, STA, Signoff); DFT and integration.
• Drive program planning, estimation, and execution in a services environment.
• Ensure adherence to schedule, quality, and PPA targets.
• Manage risk, dependencies, and change requests in dynamic customer programs.
• Support pre-sales and solutioning: effort estimation, reviews, and technical win support.

Skills

SoC Architecture

RTL to GDSII

UVM Verification

Physical Design

Tapeouts

IP Integration

Foundry Interactions

Tools

Job description

The Chip Lead at HCLTech will drive end-to-end SoC/ASIC programs for global customers, owning delivery, customer engagement, and technical leadership. The role combines deep VLSI expertise with strong program management and business-facing responsibilities.

Key Responsibilities:

Own end-to-end chip program delivery for customer engagements (architecture to silicon bring-up)

Act as primary technical interface to customers, driving trust, reviews, and escalations

Lead cross-functional teams across:

RTL Design

Verification (UVM-based)

Key Responsibilities

Physical Design (PnR, STA, Signoff)

DFT and integration

Drive program planning, estimation, and execution in a services environment

Ensure adherence to schedule, quality, and PPA (Power, Performance, Area) targets

Manage risk, dependencies, and change requests in dynamic customer programs

Support pre-sales and solutioning:

Effort estimation

Proposal reviews

Technical win support

Job description:

Job Summary: SoC Lead/Chip Lead

Role Summary:

The Chip Lead at HCLTech will drive end-to-end SoC/ASIC programs for global customers, owning delivery, customer engagement, and technical leadership. The role combines deep VLSI expertise with strong program management and business-facing responsibilities.

Key Responsibilities:

Own end-to-end chip program delivery for customer engagements (architecture to silicon bring-up)

Act as primary technical interface to customers, driving trust, reviews, and escalations

Lead cross-functional teams across:

RTL Design

Verification (UVM-based)

Key Responsibilities

Physical Design (PnR, STA, Signoff)

DFT and integration

Drive program planning, estimation, and execution in a services environment

Ensure adherence to schedule, quality, and PPA (Power, Performance, Area) targets

Manage risk, dependencies, and change requests in dynamic customer programs

Support pre-sales and solutioning:

Effort estimation

Proposal reviews

Technical win support

Skill Requirements

Enable scaling of teams (onsite-offshore model) and optimize utilization

Lead tapeout readiness reviews and post-silicon debug coordination

Required Skills & Experience:

12-16 years in VLSI / SoC development

Proven experience leading customer-facing chip programs

Strong knowledge of:

SoC architecture and integration

RTL to GDSII full flow

Verification methodologies (UVM)

Physical design and signoff

Experience in multiple successful tapeouts

Strong stakeholder management (customer + internal)

Ability to lead distributed/global teams (onsite–offshore)

Other Requirements

Experience working in semiconductor services companies (e.g., large SI/ES firms)

Exposure to advanced nodes (≤7nm)

Experience with IPs (CPU subsystems, high-speed interfaces, AI/ML accelerators)

Familiarity with foundry interactions and tapeout processes

Business & Leadership Expectations

Drive account growth (identify new opportunities within existing customers)

Balance delivery excellence + margin awareness

Mentor next-level leaders (Module Leads, Project Leads)

Bring execution rigor with customer-centric mindset

Strong communication for CXO-level interactions

Success Metrics

On-time, first-time-right tapeouts

Customer satisfaction and repeat business

Program margin and efficiency

Team retention and capability growth

https://www.linkedin.com/feed/update/urn:li:activity:7515288155340693504

Profile description:

The Chip Lead at HCLTech will drive end-to-end SoC/ASIC programs for global customers, owning delivery, customer engagement, and technical leadership. The role combines deep VLSI expertise with strong program management and business-facing responsibilities. https://www.linkedin.com/feed/update/urn:li:activity:7515288155340693504

[e-mail]

6381442306