Program Manager – Chip Design Hyderabad, Telangana, India Posted a day ago

Micron Technology, Inc

Hyderabad

Sur place

INR 4 000 000 - 7 000 000

Plein temps

14 jours+

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Résumé du poste

Micron Technology, Inc in Hyderabad, India is seeking an experienced Program Manager to lead end-to-end chip design programs from concept through tape-out and silicon bring-up. You will own coordinated schedules, milestones, and critical paths across architecture, RTL, DV, PD, CAD, DFT, AMS, packaging, and validation.

The role requires 8–15+ years in semiconductor program management, strong leadership of global teams, and data‑driven executive updates.

Qualifications

  • Bachelor’s or Master’s degree in Electrical/Electronics/Computer Engineering.
  • 8–15+ years in semiconductor/chip design programs.
  • Strong skills in schedule management, risk management, and executive communication.

Responsabilités

  • Own end-to-end program plans from concept through tape-out and silicon bring-up.
  • Lead cross-functional teams across architecture, RTL, DV, PD, CAD, and other groups.
  • Drive program reviews, milestone achievements, and stage-gate decisions.
  • Serve as single point of accountability for program status and executive updates.
  • Improve design productivity and predictability through automation and tooling.

Connaissances

Schedule management
Risk management
Executive communication
Cross-functional leadership
Global collaboration

Formation

Bachelor’s or Master’s degree in Electrical / Electronics / Computer Engineering

Outils

EDA tools
CAD

Description du poste

## Program Manager – Chip DesignHyderabad, Telangana, IndiaApply NowFind out how well you match with this jobJob ID: JR96303**Our vision is to transform how the world uses information to enrich life for *all*.**Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.## **Key Responsibilities**### **Program Planning & Execution*** Own **end‐to‐end program plans** for chip design programs from **concept → tape‐out → silicon bring‐up**.* Develop and maintain coordinated schedules, achievements, and critical paths across: + Architecture + RTL & DV + Physical Design + CAD / Methodology + DFT, AMS, Packaging, and Silicon Validation* Drive program reviews, achievement readiness, and stage‐gate decisions.### **Multi-Functional Leadership*** Act as the **primary interface** between Design, Verification, Layout, CAD, Technology, Product Engineering, Manufacturing, and Business teams.* Drive alignment across **global teams** (India, US, Japan, etc.).* Resolve **cross‐team dependencies**, priority conflicts, and execution bottlenecks.### **Risk, Issue & Transition Coordination*** Proactively identify **schedule, technical, resource, and dependency risks**.* Drive **mitigation and recovery plans** for execution gaps.* Own **change control** for scope, schedule, and resource adjustments.### **Execution Metrics & Reporting*** Define and track program critical metrics: + Schedule health + Resource loading + Design & verification readiness + Tape‐out quality indicators* Provide **clear, concise executive updates** with data‐driven insights.* Ensure clarity through dashboards and weekly program reports.### **Quality & Process Excellence*** Ensure compliance with **product lifecycle management (PLM)**, design sign‐off criteria, and quality gates.* Drive post‐mortems / retrospectives and institutionalize findings.* Partner with CAD and methodology teams to **improve design productivity and predictability** (automation, AI, tooling).### **Partner & Leadership Communication*** Serve as the **single point of accountability** for program status.* Get along with **senior leadership**, including trade‐offs, risks, and decision asks.* Influence without authority and **drive execution through teamwork**.## **Required Qualifications*** Bachelor’s or Master’s degree in **Electrical / Electronics / Computer Engineering** (or equivalent).* **8–15+ years** of experience in **semiconductor / chip design programs**.* Strong understanding of **chip design flows**, including: + Architecture & RTL + Design Verification + Physical Design / PnR + Tape‐out and silicon lifecycle* Proven experience managing large, multi-functional, multi-site programs.* Strong skills in **schedule management, risk management, and executive communication**.## **Preferred Qualifications*** Hands‐on background in **RTL, DV, PD, or CAD** (prior technical role strongly preferred).* Experience with **memory (DRAM / LPDDR / HBM)** or complex SoC programs.* Exposure to build and verification flows guided by advanced technology.* Experience driving **process improvements and automation** in design execution.## **Key Success Attributes*** Strong **ownership approach** and execution rigor.* Ability to operate in **high ambiguity, fast‐paced environments**.* Excellent **customer management and influencing skills**.* Data‐driven, structured problem solver with attention to detail.* Collaborative leader with a **global approach**.## **Impact of the Role*** Enable **predictable, high‐quality tape‐outs**.* Improve **design cycle time and execution efficiency**.* Serve as a critical pillar connecting **engineering execution with business outcomes**.
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