RF Device Modeling Engineer

Texas Instruments; Hyderabad; On-site; INR 3,500,000 - 6,000,000; Full time

Job summary

Texas Instruments in Bangalore, India, is seeking an experienced RF/SPICE modeling expert to join its elite SPICE Modeling Group. You will extract and optimize compact models for HBT/BJT, RF CMOS, and GaN devices while collaborating with analog, digital, and mixed-signal teams to drive design-technology co-optimization.

The role emphasizes automating modeling infrastructure, developing AI/ML-enhanced models, and validating models with measurements. A Ph.D.

Qualifications

• Ph.D. or Masters in Electrical Engineering or related field.
• 5+ years in compact RF SPICE modeling for HBT/BJT and CMOS.
• Expert-level RF characterization, modeling, and circuit-level validation.
• Proficiency in Cadence and SPICE simulators; Verilog-A and AI/ML data analysis valued.

Responsibilities

• Extract compact models for HBT/BJT, RF CMOS, and GaN devices.
• Deploy modeling solutions for RF topologies and co-design.
• Develop new model formulations for emerging devices.
• Automate modeling infrastructure to speed development.
• Develop AI/ML-enhanced models and extraction methods.
• Validate models with measurements and analysis.

Skills

RF modeling

RF characterization

SPICE modelling

S-parameters analysis

AI/ML data analysis

Education

Ph.D./Masters in Electrical Engineering

Tools

Cadence

Spectre

Verilog-A

MATLAB

Python

Job description

About TI

Texas Instruments Incorporated (TI) is a global semiconductor design and manufacturing company that develops analog ICs and embedded processors. By employing the world s brightest minds, TI creates innovations that shape the future of technology. TI is helping about 100,000+ customers transform the future today. We re committed to building a better future - from the responsible manufacturing of our semiconductors, to caring for our employees, to giving back inside our communities and developing great minds. Put your talent to work with us - change the world, love your job!

About the Job

Join TIs elite SPICE Modeling Group and drive cutting-edge semiconductor innovation. Youll extract and optimize compact (SPICE) models for next-generation devices while collaborating with world-class engineers across analog, digital, and mixed-signal design and process technology teams.

Location:

Bangalore, India

What Youll Do:

• Extract compact models for advanced semiconductor devices (HBT/BJT, RF CMOS, RF Passives, GaN)
• Partner with designers and technologists to deploy modeling solutions for breakthrough RF circuit topologies and drive design-technology co-optimization
• Develop innovative model formulations for emerging device technologies
• Automate modeling infrastructure to accelerate technology development
• Develop AI/ML-enhanced models and parameter extraction methodologies
• Validate models through comprehensive measurement and analysis

The person performing this role must be capable to plan effectively, drive schedules, meet critical deadlines on multiple tasks in parallel, lead technical discussions in their area of expertise, and work effectively across organizational boundaries. They must be able to clearly communicate project status and actions. Additionally, they must be able to interface with multiple organizations and work well on a diverse team to accomplish goals.

Why This Role Matters:

Your modeling expertise will directly impact TIs next-generation products, from automotive to industrial to embedded applications. You will work at the intersection of process, device physics, and circuit design, solving complex challenges and delivering cutting edge solutions.

Minimum requirements:

• Ph.D./Masters in Electrical Engineering or related field
• 5+ years in compact (SPICE) RF modeling for HBT/BJT and CMOS

Preferred qualifications:

• Expert-level experience with RF characterization, modeling, and circuit-level validation for s-parameters, noise figure, linearity, IMP3/IP3, and harmonic distortion
• Strong understanding of RF test-structures, layouts, and calibration/de-embedding techniques
• Experience with models (BSIM, MEXTRAM, HICUM, MVSG-GAN, ASM) and parameter extraction tools (ICCAP, BSIMPROPLUS, MBP, etc.)
• Deep understanding of semiconductor physics and circuit analysis
• Proficiency in EDA tools (Cadence), SPICE simulators (Spectre) and Verilog-A
• Programming skills in MATLAB/Python
• Strong data analysis skills with AI/ML expertise and TCAD experience are highly valued

Disclaimer: This job posting has been aggregated from external source. Role details, content, and availability are subject to change. Applicants are advised to confirm the latest information directly on the company website before applying.