PCB Design Engineer 2

Bytebeam; Bengaluru; On-site; INR 1,200,000 - 2,300,000; Full time

Job summary

Bytebeam seeks a seasoned Senior PCB Design Engineer to own layout execution for automotive telementics and edge gateways. You will translate schematics and mechanical constraints into manufacturable multi-layer boards, drive prototypes, and coordinate with EMS partners for high-volume production.

You'll work with HW, FW, mechanical, sourcing, and test teams to ensure EMI/EMC, thermal, and reliability targets are met, delivering robust designs for harsh automotive environments.

Qualifications

• 3–6+ years of direct PCB design and layout experience for production embedded/automotive hardware.
• Expert proficiency in Altium Designer for schematic capture, layout, and release.
• Strong understanding of high-speed routing, impedance control, and EMI/EMC practices.

Responsibilities

• Lead multi-layer PCB layout from concept to production release.
• Translate schematics and mechanical constraints into manufacturable designs.
• Collaborate with HW, FW, ME, sourcing, and EMS teams for bring-up and release.
• Prepare Gerber, IPC-2581, drill, and assembly documentation for production.
• Maintain ECAD libraries and enforce ECO workflows.

Skills

Altium Designer - Tool

High-speed PCB design

Signal integrity

Power integrity

Automotive CAN/CAN FD/OBD-II

RF layout

DFM/DFA/DFT

Thermal management

Education

Bachelor's degree in Electronics/Electrical Engineering

Tools

Altium Designer

3D STEP models

Constraint Manager

Job description

Bytebeam builds the complete hardware and software stacks that power the next generation of smart connected vehicles, fleet management infrastructure, and rugged industrial IoT deployments. From edge-device telemetry, remote hardware diagnostics, and real-time sensor processing to over-the-air (OTA) firmware updates, intelligent alert engines, and fleet-scale device management, Bytebeam helps engineering teams ship complex connected products faster and operate them reliably in the field.

At Bytebeam, hardware design does not stop at theoretical schematics, circuit simulations, or CAD layouts. We care deeply about how every board physically behaves inside a moving vehicle under extreme stress—how it gets panelized and assembled on production lines, how it survives severe electro-magnetic interference (EMI), mechanical vibration, thermal cycling, weak or noisy battery power, field harness wiring errors, and how quickly engineering teams can debug issues in the lab or in the field.

Role Overview

We are seeking a seasoned, hands-on Senior PCB Design Engineer to take complete ownership of PCB layout execution and release-quality design outputs for our flagship automotive telematics and IoT edge gateways.

This is a production-focused hardware engineering role. You will work directly from schematics, system requirements, mechanical enclosure constraints, thermal targets, and manufacturing inputs to build clean, fully manufacturable, high-yield PCB layouts. You will collaborate daily with cross-functional teams spanning Hardware Engineering, Embedded Firmware, Systems Validation, Mechanical Engineering, Component Sourcing, PCB Fabrication houses, and Contract Electronics Manufacturers (EMS). You will drive designs from initial concept and placement studies to prototype bring-up, pre-compliance testing, design iterations, and final high-volume production release.

Detailed Duties & Core Responsibilities

1. Multi-Layer PCB Layout & Execution

• Complete Board Ownership: Lead multi-layer rigid and rigid-flex PCB layout activities in Altium Designer from initial floorplanning to production package generation.
• Constraint Translation: Translate complex electrical schematics, 3D mechanical keepouts, connector locations, antenna zones, thermal relief requirements, and DFM rules into structured CAD constraints.
• Stack-Up & Layer Allocation: Define and validate layer stack-ups with PCB fabrication vendors, specifying dielectric materials, copper weights, prepreg thickness, and controlled impedance profiles (single-ended 50Ω, differential 90Ω/100Ω).
• Mixed-Signal Routing: Route complex mixed-signal systems containing high-speed MCUs/MPUs, cellular LTE/5G modems, GNSS receivers, Wi‑Fi/Bluetooth combos, automotive networks (CAN, CAN FD, OBD-II, RS‑485), USB 2.0/3.0, Ethernet, SDIO, eMMC, and power stages.
• Power & Ground Planes: Execute split-plane planning, continuous reference planes, low-impedance power distribution networks (PDN), and dedicated ground return paths for sensitive sub-circuits.

2. High-Speed, RF, and Antenna Integration

• Controlled Impedance Interfaces: Route high-speed buses (SDIO, eMMC, RGMII, USB, DDR memory) using strict length matching, skew control, phase matching, and via‑minimization techniques.
• Reference Plane Integrity: Avoid split-plane crossings, acute-angle traces, impedance discontinuities, stubs, and asymmetric via structures on high-speed lines.
• RF Circuit Layout: Implement 50Ω coplanar waveguides and microstrips for cellular, GNSS, and BLE/Wi‑Fi circuits. Place pi‑matching networks, U.FL/SMA connectors, via fences, and ground stitching to optimize wireless sensitivity.
• Isolation & EMI Mitigation: Isolate noisy switching regulators, clock generators, and digital buses away from RF front‑ends, onboard antennas, and sensitive analog sensor interfaces.

3. Automotive Protection & Compliance Design

• Transient & Surge Protection: Design vehicle power‑entry protection layouts to withstand harsh ISO 7637 and ISO 16750 transients (load dump, cold cranking, reverse polarity, jump start, and inductive spikes).
• ESD & Filtering Layout: Optimally place TVS diodes, common‑mode chokes, ferrite beads, and filter capacitors directly at connector interfaces to suppress ESD (ISO 10605 / IEC 61000‑4‑2) before noise penetrates internal circuits.
• EMC Pre‑Compliance: Apply EMI reduction techniques (e.g., ground copper pours, via stitching along board edges, localized shielding cans) to ensure pass rates during CISPR 25 radiated and conducted emissions testing.
• Thermal & Mechanical Durability: Place heat‑generating parts (power management ICs, RF power amps) with copper pours and thermal via arrays. Ensure component placement withstands long‑term automotive vibration and thermal expansion stress.

4. ECAD Library Management & Release Package Generation

• Library Creation: Build, audit, and maintain standard IPC‑7351 compliant footprint libraries, schematic symbols, and 3D STEP models within Altium Designer.
• Documentation Packages: Produce release packages including Gerber (RS‑274X / ODB++), IPC‑2581 files, drill tables, assembly drawings, fabrication notes, stack‑up diagrams, pick‑and‑place files, and BOM inputs.
• Revision Control & ECOs: Enforce strict revision management, design checklists, and Engineering Change Order (ECO) workflows across design revisions.

5. Vendor Collaboration & Hardware Bring‑Up

• DFM/DFA/DFT Review: Work with fabrication and assembly partners to resolve Design for Manufacturability, Assembly, and Test constraints prior to fabrication.
• Prototyping & Bench Debug: Support initial board bring‑up in the lab alongside hardware engineers using oscilloscopes, multimeters, spectrum analyzers, and thermal cameras to identify layout‑related noise, power drops, or signal integrity issues.
• Root Cause Analysis (RCA): Translate test feedback and failure modes into layout optimizations for subsequent board spins.
• ECAD Design Files: Complete Altium PCB layouts, schematics review, 3D STEP models, and component library assets.
• Manufacturing Deliverables: Gerber X2/ODB++, drill files, pick‑and‑place outputs, fabrication drawings, and assembly documentation.
• Engineering Constraint Records: Layer stack‑ups, impedance tables, length/skew matching logs, RF keepout maps, and thermal calculation notes.
• Compliance & Quality Documentation: Completed DFM/DFA/DFT review logs, IPC compliance verification reports, automotive ESD/EMC layout checklists, and ECO records.

Qualifications & Skill Requirements

Must‑Have Requirements

• Experience: 3–6+ years of direct PCB design and layout experience for production embedded/automotive hardware.
• Tooling: Expert proficiency in Altium Designer (schematic capture, PCB layout, constraint manager, 3D clearance checks, release wizard).
• Signal & Power Integrity: In-depth understanding of high‑speed routing rules, controlled impedance, continuous return paths, differential pair tuning, crosstalk suppression, and low‑PDN impedance.
• RF Integration: Practical experience routing 50Ω RF paths for cellular modems, GNSS receivers, and Wi‑Fi/​BLE modules with matching networks and via fencing.
• Automotive Knowledge: Understanding of vehicle battery transient behaviors, reverse polarity, load dump, TVS protection placement, and noisy bus layout (CAN, CAN FD, OBD‑II, RS‑485).
• Manufacturing Standards: Solid grasp of IPC standards (IPC‑2221, IPC‑2222, IPC‑7351) and practical DFM/DFA/DFT rules.
• Education: Degree, Diploma, B.E., or B.Tech in Electronics, Electrical, Telecommunications, or related engineering discipline.

Good‑to‑Have Skills

• Hands‑on experience with 8+ layer board stacks, HDI microvias, via‑in‑pad, or rigid‑flex technologies.
• Background in pre‑compliance lab testing for CISPR 25, ISO 7637, ISO 10605, and ISO 16750.
• Experience using simulation and calculation tools such as Saturn PCB Toolkit, Polar SI8000, Altium PDN Analyzer, or HyperLynx.
• Familiarity with AEC‑Q component standards, PPAP processes, or part lifecycle management (PLM).