NPI Engineer

Tata Electronics (TEPL); Assam; On-site; INR 900,000 - 1,500,000; Full time

Job summary

Tata Electronics (TEPL) in India seeks an experienced NPI Lead to drive SMT Box Assembly NPI from design to mass production, ensuring DFM feedback, robust project plans, and seamless documentation.

You will develop process docs, build SMT programs, optimize parameters, lead first article inspections, and collaborate with IT for MES integration, all while maintaining quality and cost targets across high-volume manufacturing.

Qualifications

• Bachelor / master in related Engineering Discipline (Preferred Mechanical / Industrial / Electronics)
• 5-8 years' experience in in SMT + Box Assembly NPI within EMS, Electronics Manufacturing, Automotive Electronics, Consumer Electronics, or similar industry.
• Expertise in SMT Processes, Reflow profiling, Stencil design, and Soldering technologies.
• Ability to interpret Gerber files, schematics, and PCB design documents.
• Knowledge of CAD/CAM tools for SMT programming Knowledge of DFM/DFT guidelines.
• Working Knowledge Handson experience on SMT Machines Screen Print, Pick n Place, Reflow AOI.
• Experience in high volume manufacturing environment.
• Strong understanding of IPC standards (IPC-A-610, J-STD-001, IPC-7351).
• Proficiency in root cause analysis problem solving tools ( 8D , 5 why , DOE )

Responsibilities

• Lead NPI Activities from design phase to mass production phase for SMT Box Assembly Processes.
• Evaluate Product designs (DFM) and provide inputs/feedback to Design Team / Customers.
• Prepare NPI Project Plans, timelines deliverables.
• Conduct feasibility studies for new processes Products.
• Provide complete NPI documentation for customer approval.
• Develop and maintain all process documentation, work instructions SOPs.
• All new models trail pre-readiness (EVT/ DVT / PVT).
• Create SMT Programs for Pick n Place/Mounter, SPP, SPI, AOI Reflow oven based on Gerber, CAD data BOM.
• Define develop jigs/ fixtures and ergonomic tools for SMT Box Assembly operations.
• Define optimal SMT parameters (Solder Paste type, Stencil design, Reflow Profile, Component Placement rule etc. )
• Develop Validate reflow Profiles for lead free processes.
• Drive First Article Inspection and resolution of SMT related defects.
• Develop process for Wave Soldering, Selective Soldering, assembly line setup, testing packaging.
• Optimize cycle times and improve process efficiency during NPI trails
• Accountable for first pass yield, final yield and field reliability.
• Lead root cause analysis for yield excursions using FMEA, DOE and failure analysis during NPI Trails.
• Ensure zero critical quality escapes at launch.
• Identify cost down opportunities (Using 4M Man, Method, Machine Material)
• To ensure Proper line setup Program version management during NPI.
• To ensure compliance with ESD, Safety IPC standards.
• Serve as a technical NPI member for customers.
• Will be technical team member for customer reviews, technology discussions and risk mitigation plans.
• Collaborate with IT teams to connect automation with MES platforms.
• Ensure seamless data flow for production monitoring and traceability.
• Ontime Product Launch First time right
• First Pass Yield and Ramp to Volume Timeline
• NPI Success Rate
• Cost to target achievement
• Customer satisfaction and audit outcomes during NPI Phase.

Skills

SMT processes

Reflow profiling

Stencil design

Soldering technologies

Gerber files interpretation

PCB design documents interpretation

DFM/DFT knowledge

Education

Bachelor / master in related Engineering Discipline (Preferred Mechanical / Industrial / Electronics)

Tools

CAD/CAM tools for SMT programming

SMT machines: Screen Print, Pick n Place, Reflow, AOI

Job description

Key Responsibilities:

1. NPI Planning Project Execution

• Lead NPI Activities from design phase to mass production phase for SMT Box Assembly Processes.
• Evaluate Product designs (DFM) and provide inputs/feedback to Design Team / Customers.
• Prepare NPI Project Plans, timelines deliverables.
• Conduct feasibility studies for new processes Products.
• Provide complete NPI documentation for customer approval.

1. New Model Readiness

• Develop and maintain all process documentation, work instructions SOPs.
• All new models trail pre-readiness (EVT/ DVT / PVT).
• Create SMT Programs for Pick n Place/Mounter, SPP, SPI, AOI Reflow oven based on Gerber, CAD data BOM.
• Define develop jigs/ fixtures and ergonomic tools for SMT Box Assembly operations.
• Define optimal SMT parameters (Solder Paste type, Stencil design, Reflow Profile, Component Placement rule etc. )
• Develop Validate reflow Profiles for lead free processes.
• Drive First Article Inspection and resolution of SMT related defects.
• Develop process for Wave Soldering, Selective Soldering, assembly line setup, testing packaging.
• Optimize cycle times and improve process efficiency during NPI trails

1. Quality Excellence

• Accountable for first pass yield, final yield and field reliability.
• Lead root cause analysis for yield excursions using FMEA, DOE and failure analysis during NPI Trails.
• Ensure zero critical quality escapes at launch.

1. Operational Excellence Cost Optimization

• Identify cost down opportunities (Using 4M Man, Method, Machine Material)
• To ensure Proper line setup Program version management during NPI.
• To ensure compliance with ESD, Safety IPC standards.

1. Customer Stakeholder Engagement

• Serve as a technical NPI member for customers.
• Will be technical team member for customer reviews, technology discussions and risk mitigation plans.

1. System Integration

• Collaborate with IT teams to connect automation with MES platforms.
• Ensure seamless data flow for production monitoring and traceability.

Key Deliverables KPI

• Ontime Product Launch First time right
• First Pass Yield and Ramp to Volume Timeline
• NPI Success Rate
• Cost to target achievement
• Customer satisfaction and audit outcomes during NPI Phase.

Required Qualifications

• Bachelor / master in related Engineering Discipline (Preferred Mechanical / Industrial / Electronics)
• 5-8 years' experience in in SMT + Box Assembly NPI within EMS, Electronics Manufacturing, Automotive Electronics, Consumer Electronics, or similar industry.
• Expertise in SMT Processes, Reflow profiling, Stencil design, and Soldering technologies.
• Ability to interpret Gerber files, schematics, and PCB design documents.
• Knowledge of CAD/CAM tools for SMT programming Knowledge of DFM/DFT guidelines.
• Working Knowledge Handson experience on SMT Machines Screen Print , Pick n Place , Reflow AOI.
• Experience in high volume manufacturing environment.
• Strong understanding of IPC standards (IPC-A-610, J-STD-001, IPC-7351).
• Proficiency in root cause analysis problem solving tools ( 8D , 5 why , DOE )

Key Responsibilities:

1. NPI Planning Project Execution

• Lead NPI Activities from design phase to mass production phase for SMT Box Assembly Processes.
• Evaluate Product designs (DFM) and provide inputs/feedback to Design Team / Customers.
• Prepare NPI Project Plans, timelines deliverables.
• Conduct feasibility studies for new processes Products.
• Provide complete NPI documentation for customer approval.

1. New Model Readiness

• Develop and maintain all process documentation, work instructions SOPs.
• All new models trail pre-readiness (EVT/ DVT / PVT).
• Create SMT Programs for Pick n Place/Mounter, SPP, SPI, AOI Reflow oven based on Gerber, CAD data BOM.
• Define develop jigs/ fixtures and ergonomic tools for SMT Box Assembly operations.
• Define optimal SMT parameters (Solder Paste type, Stencil design, Reflow Profile, Component Placement rule etc. )
• Develop Validate reflow Profiles for lead free processes.
• Drive First Article Inspection and resolution of SMT related defects.
• Develop process for Wave Soldering, Selective Soldering, assembly line setup, testing packaging.
• Optimize cycle times and improve process efficiency during NPI trails

1. Quality Excellence

• Accountable for first pass yield, final yield and field reliability.
• Lead root cause analysis for yield excursions using FMEA, DOE and failure analysis during NPI Trails.
• Ensure zero critical quality escapes at launch.

1. Operational Excellence Cost Optimization

• Identify cost down opportunities (Using 4M Man, Method, Machine Material)
• To ensure Proper line setup Program version management during NPI.
• To ensure compliance with ESD, Safety IPC standards.

1. Customer Stakeholder Engagement

• Serve as a technical NPI member for customers.
• Will be technical team member for customer reviews, technology discussions and risk mitigation plans.

1. System Integration

• Collaborate with IT teams to connect automation with MES platforms.
• Ensure seamless data flow for production monitoring and traceability.

Key Deliverables KPI

• Ontime Product Launch First time right
• First Pass Yield and Ramp to Volume Timeline
• NPI Success Rate
• Cost to target achievement
• Customer satisfaction and audit outcomes during NPI Phase.

Required Qualifications

• Bachelor / master in related Engineering Discipline (Preferred Mechanical / Industrial / Electronics)
• 5-8 years' experience in in SMT + Box Assembly NPI within EMS, Electronics Manufacturing, Automotive Electronics, Consumer Electronics, or similar industry.
• Expertise in SMT Processes, Reflow profiling, Stencil design, and Soldering technologies.
• Ability to interpret Gerber files, schematics, and PCB design documents.
• Knowledge of CAD/CAM tools for SMT programming Knowledge of DFM/DFT guidelines.
• Working Knowledge Handson experience on SMT Machines Screen Print , Pick n Place , Reflow AOI.
• Experience in high volume manufacturing environment.
• Strong understanding of IPC standards (IPC-A-610, J-STD-001, IPC-7351).
• Proficiency in root cause analysis problem solving tools ( 8D , 5 why , DOE )