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L&T Semiconductor Technologies in Bengaluru, India, seeks two NoC Design Leads to own the stacked Network-on-Chip for high‑performance SoCs, delivering 12 TB/s cross‑section bandwidth.
You will architect topology, routing, QoS, and bandwidth allocation across BFOS arrays, SRAM banks, HBM controllers, UCIe links, and host interface, and drive RTL integration.
This role requires 10+ years of experience in on‑chip interconnects and strong leadership across cross‑functional teams.
We are hiring two NoC Design Leads to own the stacked Network-on-Chip that forms the data backbone of xPU - 4 physical planes delivering 12 TB/s cross-section bandwidth. You will architect and implement coherency, routing, QoS, and bandwidth allocation across the BFOS arrays, banked SRAM, HBM controllers, UCIe links, and the host interface. This role is central to sustaining the extreme bandwidth and latency targets the compute architecture demands.