Senior Staff / Principal SOC Floorplan Lead

EnCharge AI, Inc.; Bengaluru; On-site; INR 4,800,000 - 7,000,000; Full time

Benefits offered by this job

Equity

Flat, collaborative culture

Job summary

Doist is seeking a highly skilled SoC Floorplan Lead to own the physical foundation of next-generation AI and data center SoCs. You will bridge architecture, RTL, and physical design, influencing micro-architecture for top-tier PPA on advanced nodes and collaborating with chip architects and RTL leads.

You will drive floorplanning, bump planning, AMS routing, PDN design, and top-level timing optimization in a fast-moving startup environment, with a strong emphasis on ownership and execution.

Qualifications

• 12+ years of hands-on Physical Design/SoC Floorplanning experience
• Lead or primary owner of SoC-level Floorplanning for large, complex chips
• Strong collaboration across Architecture, RTL, and physical design teams
• Experience with bump planning, package requirements, and die-to-package co-optimization
• Knowledge of analog/mixed-signal IP integration and high-speed interfaces
• Experience with multi-die/chiplet concepts (2.5D, 3D packaging, interposers) is a plus
• Scripting and automation proficiency (Tcl, Python, Perl, Makefile)

Responsibilities

• Own the SoC floorplan from concept to tape-out for AI/Data Center chips on advanced nodes
• Provide physical feasibility feedback to Architecture and RTL; drive block partitioning and data-flow planning
• Lead bump planning and IO ring definition; coordinate with packaging on constraints and power delivery
• Manage placement, routing strategies for AMS IPs, SerDes, PLLs, and clock distributions
• Design and analyze the top-level Power Delivery Network (PDN) for high-current AI workloads
• Oversee macro placement, pin assignments, and top-level feedthrough planning to optimize timing
• Develop scalable floorplanning workflows and TCL/Python scripts for a lean startup team

Skills

Leadership

Ownership

Scripting/Automation

Ambiguity tolerance

Education

BS/MS/PhD in EE/CE or related field

Tools

Cadence Innovus

Job description

The Role

We are seeking a highly skilled and hands-on SoC Floorplan Lead to own the physical foundation of our next-generation AI and Data Center SoCs. In this critical role, you will be the bridge between architecture, logic design, and physical design. You will work hand-in-hand with Chip Architects and RTL Leads to influence micro-architecture and ensure the physical implementation achieves best-in-class Power, Performance, and Area (PPA). If you love solving complex spatial puzzles on advanced technology nodes, integrating sensitive analog components, and driving execution in a high-energy start-up environment, this is the role for you.

Key Responsibilities

• Top-Level Floorplanning: Own the SoC-level floorplan from concept to tape-out for high-performance, large-scale AI/Data Center chips on advanced process nodes (e.g., 5nm, 3nm or below).
• Architecture & RTL Collaboration: Partner closely with Architecture and RTL teams to provide early physical feasibility feedback. Drive block partitioning, shape optimization, and data-flow planning to achieve the absolute best PPA.
• Bump & Package Co-Design: Lead bump planning and IO ring definition. Work with packaging teams on flip-chip/advanced packaging constraints, ensuring optimal signal escape and power delivery.
• Custom & Analog Routing: Manage the placement and custom routing strategies for critical Analog/Mixed-Signal (AMS) IPs, high-speed SerDes (PCIe, Ethernet, Memory interfaces), PLLs, and sensitive clock distributions.
• Power Delivery Network (PDN): Design and analyze the top-level power grid, ensuring robust power delivery for high-current AI workloads while minimizing IR drop.
• Pin Assignment & Feedthroughs: Manage macro placement, block-level pin assignments, and top-level feedthrough planning to optimize global timing and routing congestion.
• Methodology Development: Build and maintain scalable Floorplanning workflows and scripts (Tcl, Python) tailored for a lean, fast-moving start-up team.

Required Skills & Qualifications

• Experience: 12 + years of hands-on experience in Physical Design SoC Floor planning preferably in Datacenter domain , with at least 3 years acting as a lead or primary owner of SoC-level Floorplanning.
• Domain Expertise: Proven track record of taping out large, complex chips—specifically for Data Center, Networking, or AI/Machine Learning applications.
• Start-Up Mentality: Highly driven, self-motivated, and comfortable with ambiguity. You take extreme ownership of your domain, pivot quickly when needed, and roll up your sleeves to get things done.
• Technical Depth: Deep understanding of how RTL structures and architectural decisions impact physical design PPA. Extensive experience with bump planning, flip-chip package requirements, and die-to-package co-optimization. Strong knowledge of analog/mixed-signal IP integration, shielding, and custom routing constraints. Expertise with industry-standard physical design tools ( Cadence Innovus).
• Education: BS, MS, or Ph.D. in Electrical Engineering, Computer Engineering, or a related field.
• Preferred Qualifications: Experience with multi-die / chiplet integration (2.5D, 3D packaging, interposers, UCIe). Strong scripting and automation skills (Tcl, Python, Perl, Makefile). Knowledge of advanced clocking architectures (H-trees, meshes) for highly synchronous AI fabrics.

What We Offer Impact

• Impact: The opportunity to build ground-up architecture and see your ideas taped out in cutting-edge silicon.
• Equity: Competitive start-up equity packages—when the company wins, you win.
• Culture: A flat, collaborative, and bureaucracy-free environment surrounded by top-tier industry veterans.