NAND Custom Test Circuit Design Engineer

Micron Technology, Inc; Hyderabad; On-site; INR 1,000,000 - 2,000,000; Full time

Job summary

Micron Technology, Inc. in Hyderabad is seeking a NAND Custom Test Circuit Design Engineer to develop, integrate and optimize advanced test circuits for flash memory.

You will work on transistor-level and mixed-signal circuits, validate with XA simulations, Verilog, and collaborate with layout and product engineering teams. The role emphasizes AI-enabled workflows, scripting for automation, and ensuring reliability, power, and area targets across wafer and package levels.

Qualifications

• Bachelor’s or Master’s in Electrical/Electronics or related field with 2+ years of experience.
• Hands-on experience in custom/analog circuit design and memory peripheral circuits.
• Strong CMOS device operation knowledge, parasitics, PVT sensitivity, timing and reliability principles.
• Proficiency in circuit debugging, waveform analysis, and post-layout verification.
• Proficiency in XA or equivalent transistor-level simulations and Verilog.
• NAND flash memory architecture familiarity is a plus.
• Proficient in Python scripting for automation and data processing.
• Ability to identify workflows that can be improved through AI and develop AI-enabled solutions.

Responsibilities

• Develop, integrate, and optimize custom test circuit architectures for NAND flash memory designs.
• Interpret specifications and define circuit functionality, interfaces, limits, and validation criteria.
• Create, review, and optimize schematics, sizing, bias structures, sensing paths, and test multiplexers.
• Analyze circuit testability and robustness for quality, coverage, manufacturability, power, area, and reliability.
• Validate custom test circuits using XA simulations, Verilog simulations, and mixed-signal environments.
• Collaborate with layout teams on matching, parasitics, shielding, routing, and post-layout review.
• Evaluate risks like leakage, contention, floating nodes, overstress, power sequencing, EM/IR.
• Create and debug test sequences and modes to control/observe/test at wafer and package levels.
• Work with Product Engineering during first-silicon bring-up, debug, and ramp to high-volume production.
• Use lab measurements and silicon data to drive improvements.

Skills

CMOS design

Transistor-level design

Mixed-signal design

Python scripting

Verilog simulations

AI-assisted engineering

Circuit validation

Test automation

Education

Bachelor's or Master's in Electrical Engineering

Tools

XA simulations

Job description

Req. ID: JR107790 NAND Custom Test Circuit Design Engineer

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Key Responsibilities

• Develop, integrate, and optimize custom test circuit architectures for NAND flash memory designs, including transistor-level digital, analog, mixed-signal, monitoring, control, and memory-array interface circuits.
• Interpret product specifications and test requirements; define circuit functionality, interfaces, operating limits, controllability, observability, and validation criteria.
• Create, review, and optimize schematics, device sizing, bias structures, sensing and monitoring paths, multiplexers relevant to test circuits.
• Analyze circuit testability and robustness to ensure compliance with quality, coverage, manufacturability, power, area, and reliability requirements.
• Validate custom test circuits using XA simulations, Verilog simulations, and mixed-signal validation environments.
• Collaborate closely with layout teams on matching, parasitic sensitivity, shielding, routing, guard rings, device placement, and layout-dependent effects; review post-layout results and drive closure.
• Evaluate circuit risks including leakage, contention, floating nodes, device overstress, power sequencing, current density, EM/IR, and long-duration stress conditions.
• Create and debug test sequences and test modes required to control, observe, characterize, and validate custom test circuits at wafer and package levels.
• Work with Product Engineering during first-silicon bring-up, debug and characterization, failure isolation, simulation-to-silicon correlation, and ramp to high-volume production.
• Use laboratory measurements and silicon data to identify root cause and recommend circuit, test-mode, characterization, or screening improvements.
• Apply a Design + AI approach as a core responsibility by using AI-assisted and agentic engineering workflows to accelerate circuit review, simulation triage, waveform analysis, root-cause investigation, automation, documentation, and knowledge retrieval while maintaining engineering rigor and sign-off discipline.
• Develop Python or scripting-based automation and AI-enabled solutions that improve design quality, reduce turnaround time, and increase engineering productivity.
• Document test-circuit methodologies, specifications, design decisions, validation results, silicon correlation, and clear technical recommendations.

Required Qualifications and Skills

• Bachelor's or Master's degree in Electrical Engineering, Electronics Engineering, Computer Engineering, or a related field with 2+ years of experience
• Relevant hands‑on experience in custom/analog circuit design, mixed‑signal design, memory peripheral circuit design, or Product Engineering with strong transistor‑level circuit and silicon‑debug exposure.
• Strong understanding of CMOS device operation, transistor‑level circuit design, leakage mechanisms, parasitics, PVT sensitivity, timing, loading, noise margin, power, and reliability principles.
• Hands‑on proficiency with circuit build entry, waveform debug and post‑layout verification.
• Proficiency in XA or equivalent fast transistor‑level simulation, Verilog, and mixed‑signal validation methodologies.
• Preferred (not must) solid understanding of NAND flash memory architecture, test modes, peripheral circuits, internal signal access, and wafer/package test considerations.
• Proficiency in Python and scripting for simulation automation, regression analysis, result extraction, waveform processing, and engineering efficiency.
• Ability to identify workflows that can be improved through AI, develop or adapt AI‑enabled engineering solutions, and apply appropriate technical review, data protection, and engineering judgment.
• Excellent problem‑solving skills, strong attention to detail, and effective interpersonal skills for multi‑functional, global collaboration.
• Nice to have: Laboratory skills using oscilloscope, logic or signal analyzer, source‑measure equipment, function generator, and hands‑on testing of silicon at wafer and package levels.

Job Profile(s)

• Semiconductor Design Engineer 3

Relocation level: (TBD)

Before Getting Started

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As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time‑off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.