Mechanical Engineering Technical Architect | Solid modelling, Structural Simulation, System Thermal Design

Cisco Systems, Inc

Bengaluru

On-site

INR 2,500,000 - 7,000,000

Full time

8 days ago

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Job summary

Cisco Systems, Inc. Bengaluru, in the Hardware Platform Group, seeks a senior Mechanical Engineer with 16+ years in Telecom & Datacentre product design.

You will lead multi-disciplinary teams, define system thermal architecture, mentor engineers, and ensure robust mechanical validation using Creo/UG-NX and Ansys. You will collaborate with FPGA, ASIC, software and diagnostics groups to deliver reliable cooling solutions for next‑gen data centre products.

Qualifications

  • 16+ years of hands-on experience in Telecom & Datacentre product design with MTech/BTech in Mechanical Engineering OR 12+ yrs with PhD in Thermal Engineering or related specialization.
  • Experience with solid modelling tools such as Creo and UG‑NX.
  • Hands on experience with structural simulation tools like Ansys.
  • Mentoring and leading a technical team; people management would be an advantage.
  • Hands-on experience on System Thermal Design and Validation.

Responsibilities

  • Design and development of next generation Telecom & Datacentre products.
  • Participate in the architecture definition, implementation and verification phases.
  • Work closely with ASIC team during initial characterisation and define system level integration based on input.
  • Develop and implement process and design improvement guidelines.
  • Work with multi-functional teams (hardware, software, diagnostics and signal integrity).
  • Assist in complex subsystem lab bring-up, integration and unit test validation.
  • Lead and mentor a technical team; formulate processes for upskilling and career growth.
  • Maintain strong documentation and data management for knowledge sharing.
  • Lead multiple concept designs and communicate status with customers and executives.
  • Hands-on examples of using AI tools for automation and faster data retrieval.

Skills

Creo
UG-NX
Ansys
Leadership
Mentoring
Documentation
Team management
Communication
AI tools

Education

MTech in Mechanical Engineering
BTech in Mechanical Engineering
PhD in Thermal Engineering

Tools

Creo
UG-NX
Ansys

Job description

We are part of the Hardware Platform Group, with our team specializing in FPGA development. Our work spans both sophisticated data-path and challenging control-path FPGAs. The design process includes crafting the FPGA functional specification document, RTL coding, image generation and validation. We leverage industry-standard tools for FPGA design, incorporating various quality metrics to ensure a robust process. Our ultimate goal is to deliver bug-free RTL for first-pass success on the board. Additionally, we collaborate closely with our remote teams based in US and Italy.

Your Impact
  • Design and development of next generation Telecom & Datacentre products
  • Participate in the architecture definition, implementation and verification phases.
  • Work closely with ASIC team during initial characterisation and define system level integration based on acquired input.
  • Develop and implement process and design improvement guidelines and ensure they are relevant to the latest Design methodology.
  • Work with multi-functional teams (hardware, software, diagnostics and signal integrity groups).
  • Assist in complex subsystem level lab bring-up, integration, and unit test validation.
  • Prior experience of leading a Technical team and Mentoring them for personal growth and formulate processes that allow team to upskill and achieve their career goals.
  • Have strong documentation and data management skills to ensure lessons learnt and accessible to the wider team
  • Should be able to lead multiple concept designs by guiding the team to achieve the best design solution and also effectively communicate the status with customer and executives.
  • Hands-on examples of using Ai tools for automation and faster data retrieval
Minimum Qualifications
  • Educational Background: Requires 16+ years of hands-on experience in design of Telecom & Datacentre products with MTech/BTech in Mechanical Engineering OR 12+ yrs with PhD in Thermal Engineering or related specialisation
  • Experienced in solid modelling Tools such as Creo and UG-NX
  • Hands on experience with Structural Simulation tools like Ansys
  • Working examples of mentoring and leading a technical team, experience as a people manager would be an advantage
  • Hands-on experience on System Thermal Design and Validation.
Preferred Qualifications
  • Knowledge on mechanical reliability tests and Material selection to cater to corrosive environments
  • Should have the drive to sustain continued innovation in design and cooling solutions.
  • Should be able to drive power optimisation by defining intelligent Fan algorithm considering all real-world scenarios.
  • Good English written and verbal communications. Self-motivation, partnership and strong interpersonal skills are needed.
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