Mechanical Engineering Technical Architect | Solid modelling, Structural Simulation, System Th[...]

Cisco; Bengaluru; On-site; INR 4,000,000 - 7,000,000; Full time

Job summary

Cisco Bengaluru seeks a senior Mechanical/Thermal lead for Telecom & Datacentre product development. You will drive design, architecture, and validation, shaping robust, reliable systems.

Ideal candidates bring 16+ years in telecom/datacentre hardware with Creo/UG-NX and Ansys, plus mentoring experience and a passion for process improvement. This on-site role collaborates with global teams to deliver first‑pass quality.

Qualifications

• Requires 16+ years hands-on telecom/datacentre product design experience with advanced mechanical engineering education.
• Hands-on experience with Creo and UG-NX for solid modelling.
• Experience with Ansys for structural and thermal simulation.
• Proven mentoring skills; people management would be an advantage.
• Experience in system thermal design and validation.

Responsibilities

• Design and develop next generation Telecom & Datacentre products.
• Participate in architecture definition, implementation and verification phases.
• Collaborate with ASIC team during characterization and system integration.
• Define and implement design/process guidelines for thermal and mechanical reliability.
• Lead cross‑functional teams across hardware, software, diagnostics and signal integrity.
• Mentor and lead a technical team, guiding career growth and process improvement.
• Document lessons learned and ensure knowledge is accessible to the team.
• Lead multiple concept designs and communicate status to customers and executives.
• Provide hands-on examples of AI tools for automation and faster data retrieval.

Skills

Creo

UG-NX

Ansys

Mentoring/People management

Education

MTech/BTech in Mechanical Engineering

PhD in Thermal Engineering or related specialization

Tools

Creo

UG-NX

Ansys

Job description

Meet the Team

We are part of the Hardware Platform Group, with our team specializing in FPGA development. Our work spans both sophisticated data‑path and challenging control‑path FPGAs. The design process includes crafting the FPGA functional specification document, RTL coding, image generation and validation. We leverage industry‑standard tools for FPGA design, incorporating various quality metrics to ensure a robust process. Our ultimate goal is to deliver bug‑free RTL for first‑pass success on the board. Additionally, we collaborate closely with our remote teams based in the US and Italy.

Your Impact

• Design and development of next generation Telecom & Datacentre products
• Participate in the architecture definition, implementation and verification phases.
• Work closely with the ASIC team during initial characterisation and define system level integration based on acquired input.
• Develop and implement process and design improvement guidelines and ensure they are relevant to the latest Design methodology.
• Work with multi‑functional teams (hardware, software, diagnostics and signal integrity groups).
• Assist in complex subsystem level lab bring‑up, integration, and unit test validation.
• Prior experience of leading a Technical team and mentoring them for personal growth and formulating processes that allow the team to upskill and achieve their career goals.
• Have strong documentation and data management skills to ensure lessons learned are accessible to the wider team.
• Lead multiple concept designs by guiding the team to achieve the best design solution and also effectively communicate the status with customer and executives.
• Hands‑on examples of using AI tools for automation and faster data retrieval.

Minimum Qualifications

• Educational Background: Requires 16+ years of hands‑on experience in design of Telecom & Datacentre products with MTech/BTech in Mechanical Engineering OR 12+ years with PhD in Thermal Engineering or related specialisation.
• Experienced in solid modelling tools such as Creo and UG‑NX.
• Hands‑on experience with structural simulation tools like Ansys.
• Working examples of mentoring and leading a technical team; experience as a people manager would be an advantage.
• Hands‑on experience on system thermal design and validation.

Preferred Qualifications

• Knowledge on mechanical reliability tests and material selection to cater to corrosive environments.
• Should have the drive to sustain continued innovation in design and cooling solutions.
• Should be able to drive power optimisation by defining intelligent fan algorithm considering all real‑world scenarios.
• Good English written and verbal communications. Self‑motivation, partnership and strong interpersonal skills are needed.