Lead Engineer - Stress Analyst

Carrier; Hyderabad; On-site; INR 2,000,000 - 3,600,000; Full time

Benefits offered by this job

Total rewards package

Well-being programs

Job summary

Carrier is seeking an experienced Lead Engineer - Stress Analyst in Hyderabad to perform advanced FEA and electronics cooling simulations. You will work with design, testing, manufacturing, and systems teams to meet structural, durability, and thermal requirements.

The role requires strong fundamentals in solid mechanics, dynamic analysis, and CAE tools, with a focus on engineering analysis, validation, and robust design decisions.

Qualifications

• Bachelor’s or Master’s degree in mechanical, aerospace, automotive, applied mechanics or related field.
• Hands-on experience with structural/thermal CAE in product development environments.
• Strong fundamentals in solid mechanics, materials, and boundary conditions.
• Experience with static, dynamic, explicit simulations and CAE-to-test correlation.

Responsibilities

• Perform linear and nonlinear structural analysis to evaluate stresses, deformation, and load paths.
• Conduct modal, harmonic, random vibration, and frequency-response analyses.
• Execute explicit, drop and impact simulations; assess energy balance and contact forces.
• Perform electronics cooling and thermal analyses for components and enclosures.
• Develop high-quality FE models, boundary conditions, and mesh verification.
• Interpret results and provide actionable design recommendations with clear documentation.

Skills

Finite element methods

Solid mechanics

Structural dynamics

Thermal analysis

Vibration analysis

Python scripting

Education

Bachelor’s or Master’s degree in mechanical engineering/related field

Tools

ANSYS Mechanical

ANSYS LS-DYNA

ANSYS Fluent/Icepak

Altair HyperMesh

HyperView/OptiStruct

Job description

About Carrier

Carrier Global Corporation, global leader in intelligent climate and energy solutions, is committed to creating innovations that bring comfort, safety and sustainability to life. Through cutting-edge advancements in climate solutions such as temperature control, air quality and transportation, we improve lives, empower critical industries and ensure safe transport of food, life-saving medicines and more. Since inventing modern air conditioning in 1902, we lead with purpose: enhancing the lives we live and the world we share. We continue to lead because of our world-class, inclusive workforce that puts the customer at the center of everything we do. For more information, visit corporate.carrier.com or follow Carrier on social media at @Carrier.

Role

Lead Engineer - Stress Analyst

Location

Hyderabad

Full/ Part-time:

Full time

About The Role

We are seeking an experienced FEA & Electronics Cooling Simulation Engineer responsible for performing advanced structural, dynamic, explicit, and thermal simulations to support product design, optimization, validation, and troubleshooting.

The candidate should have strong fundamentals in finite element analysis and hands-on experience with linear and nonlinear structural analysis, vibration and dynamic analysis, drop/impact simulations, and electronics cooling/thermal analysis. The role will work closely with Design, Product, Testing, Manufacturing, and Systems Engineering teams to ensure designs meet structural, durability, thermal, and performance requirements.

Job Responsibility

Structural FEA

• Perform linear static analysis to evaluate stress, strain, deformation, stiffness, and load paths.
• Conduct nonlinear analysis, including: Material nonlinearity/plasticity Geometric nonlinearity/large deformation Contact and friction Bolt/fastener and joint behavior
• Evaluate sheet-metal, cast, welded, bolted, and structural assemblies.
• Perform design iterations and recommend structural improvements based on simulation results.
• Support design optimization, weight reduction, material changes, and cost-reduction/VAVE projects.

Dynamic & Vibration Analysis

Perform Structural Dynamic Analyses Including

• Modal analysis
• Natural frequency and mode-shape evaluation
• Harmonic response analysis
• Random vibration/PSD analysis
• Shock/transient response analysis
• Frequency-response assessments
• Evaluate resonance risks and recommend design modifications.
• Support simulation-to-test correlation using vibration and modal test results.

Explicit, Drop & Impact Analysis

• Perform explicit nonlinear simulations for highly transient events.
• Develop simulation methodologies for: Drop tests Impact events Shock loading Component-to-component impact Large deformation Severe contact conditions
• Evaluate plastic deformation, acceleration, stress/strain, energy balance, contact forces, and structural integrity during impact events.
• Correlate simulation results with physical drop/impact testing where data is available.

Electronics Cooling & Thermal Analysis

• Perform electronics cooling and thermal simulations for electronic components, enclosures, and systems.
• Evaluate: Component/junction temperatures PCB thermal performance Heat sinks Fans and forced convection Natural convection Conduction paths Airflow distribution Pressure drop Hot spots and thermal bottlenecks
• Assess thermal-management concepts and recommend improvements to cooling architecture.
• Map thermal or pressure loads from CFD analysis into structural FEA models where required.
• Perform thermal-structural analysis to evaluate deformation and stresses generated by temperature distributions.

Pre/Post-Processing & Modeling

• Develop high-quality finite element models using 1D, 2D/shell, and 3D/solid elements as appropriate.
• Define realistic boundary conditions, contacts, joints, connectors, fasteners, materials, and loading conditions.
• Perform mesh-quality and mesh-convergence assessments.
• Perform CFD-to-FEA load transfer, such as: Pressure mapping Temperature mapping Spatially varying load mapping
• Review model assumptions and ensure that simulation methodologies appropriately represent actual product behavior.

Engineering Analysis & Validation

• Interpret analysis results and translate them into actionable design recommendations, rather than simply reporting stresses or temperatures.
• Identify potential structural and thermal weaknesses early in the product-development cycle.
• Define analysis assumptions, acceptance criteria, margins, and limitations.
• Support design reviews, DFMEA, validation planning, and root-cause investigations.
• Develop engineering reports and presentations clearly documenting: Objective Methodology Assumptions Boundary conditions Results Conclusions Recommendations
• Collaborate with test engineers to improve CAE-to-test correlation and update simulation methodologies based on test results.

Preferred CAE Tools

• Hands-on experience with several of the following is preferred:
• ANSYS Mechanical
• ANSYS LS-DYNA / LS-DYNA
• ANSYS Fluent / Icepak
• Altair HyperMesh
• Altair HyperView
• OptiStruct / Radioss
• SpaceClaim or equivalent CAD-preparation tools
• Experience working with CAD platforms such as Creo, NX, or SolidWorks would be beneficial.

Requirements

• Strong fundamentals in: Solid mechanics Strength of materials Finite element methods Structural dynamics Heat transfer Contact mechanics Material plasticity
• Understanding of metallic and polymer material behavior.
• Good understanding of static versus dynamic loading and implicit versus explicit solution methodologies.
• Ability to assess FEA model quality and recognize unrealistic boundary conditions, contacts, mesh behavior, or solver results.
• Ability to troubleshoot convergence problems in nonlinear simulations.
• Knowledge of fatigue and durability assessment is desirable.
• Experience with scripting/automation using Python, APDL, TCL, or similar tools is an advantage.
• Bachelor’s or master’s degree in mechanical engineering, Aerospace Engineering, Automotive Engineering, Applied Mechanics, or a related engineering discipline.
• Relevant hands‑on experience in structural/thermal CAE and product‑development environments.
• Experience supporting simulation-driven design decisions and physical validation is highly desirable.
• Strong analytical and problem‑solving ability
• Sound engineering judgment
• Ability to independently develop appropriate FEA methodologies
• Ability to distinguish modeling issues from actual design problems
• Strong communication and technical presentation skills
• Effective collaboration with Design, Testing, Systems, Manufacturing, and Product Engineering teams
• Ability to manage multiple simulation activities and priorities

Benefits

We offer a competitive total rewards package that may include other benefits and well being programs. Offerings vary by role and location and are designed to support employees’ health, security, and success.

Equal Treatment and Non-Discrimination

Carrier is committed to equal treatment and non-discrimination principles. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, or disability, or any other applicable protected class.

If you require a reasonable accommodation to complete the application process, participate in an interview, or otherwise engage in the hiring process, please contact us at [e-mail]. We will make every effort to meet your needs in accordance with applicable laws.

Carrier is An Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability or veteran status, age or any other federally protected class.

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