Lead Engineer - PCB Design

Eaton Group

Pune District

On-site

INR 4,200,000 - 6,400,000

Full time

2 days ago
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Job summary

Eaton Group in Pune is seeking a Lead PCB Design Engineer to drive end-to-end PCB development for data center power and thermal management products. You will lead schematic reviews, layout, validation, and production release while mentoring designers across global teams.

The role requires deep knowledge of high-power PCBs, HDI, SI/PI analysis, EMC/EMI, and manufacturability, with collaboration across electrical, mechanical, firmware, and test groups to deliver reliable, cost-efficient solutions.

Qualifications

  • Bachelor’s degree in Electronics / Electrical Engineering.
  • 12–14 years of PCB design experience in power electronics or thermal management.
  • Experience leading PCB programs and cross-functional teams.

Responsibilities

  • Lead end-to-end PCB development from concept to production release.
  • Mentor PCB designers and provide technical leadership across global teams.
  • Design complex multi-layer PCBs for data center power, thermal management, and rack structures.
  • Ensure SI/PI, EMC/EMI, thermal performance, manufacturability, and compliance.

Skills

Altium Designer
Cadence Allegro
HDI PCBs
High Power PCBs
High Speed Interfaces
SI/PI analysis
Thermal-aware design

Education

Bachelor's Degree in Electronics/Electrical Engineering

Tools

CAM350

Job description

What you’ll do:

The Lead PCB Design Engineer is responsible for leading the design, development, and optimization of printed circuit board (PCB) solutions for electronic products. This role ensures high-quality, manufacturable, and reliable PCB designs, drives design standardization and process improvements, provides technical leadership, and collaborates with cross-functional teams to deliver innovative and cost-effective products

  • Lead end-to-end PCB development from concept, schematic review, layout, validation, and production release.
  • Able to lead Program with multiple PCBs and deliver with help of one or more resources
  • Design complex multi-layer PCBs for:
    • Data center power distribution and management systems
    • Thermal management and cooling control systems
    • Know-how of OCP Rack and its structure
    • Hands-on experience in High Voltage, High Current PCBs
  • Develop PCB solutions considering:
    • Signal Integrity (SI)
    • Power Integrity (PI)
    • EMC/EMI compliance
    • Thermal performance
    • Reliability and Manufacturability
  • Define stack-ups, controlled impedance requirements, high-current power routing, grounding strategies, and power distribution networks.
  • Collaborate with electrical, mechanical, thermal, firmware, manufacturing, and test teams to optimize overall product performance.
  • Support design reviews, prototype builds, debugging, root-cause analysis, qualification testing, and certification activities.
  • Drive PCB design standardization, library management, design automation, and continuous improvement initiatives.
  • Mentor PCB designers and provide technical leadership across global engineering teams.
Qualifications:

Required: Bachelor’s Degree in Electronics / Electronics and Communication / Electrical Engineering.

  • 12–14 years of PCB design experience in power electronics or thermal management products.
Skills:
  • Expert knowledge of multi-layer PCB design using Altium Designer, Cadence Allegro, or equivalent EDA tools.
  • Strong experience in below:
    • Experience with High Power, Flex, Rigid Flex & HDI PCBS.
    • High-speed interfaces (DDR, PCIe, Ethernet, USB, SerDes)
    • Power electronics and power conversion systems
    • Creepage clearance and safety requirements
    • SI/PI analysis and simulation
    • Thermal-aware PCB design
    • DFM, DFA, and DFT methodologies

Well versed with Data Center Rack Architectures, including rack-level power distribution, monitoring, control systems, AI/HPC infrastructure, and cooling solutions.

Good understanding of thermal management technologies including air-cooled and liquid-cooled systems used in modern data centers.

Able to do Power Integrity or Signal Integrity Simulations will be added advantage

Standards & Compliance:
  • IPC Standards: IPC-2221/2222, IPC-7351, IPC-A-600, IPC-A-610, IPC-6012, IPC-2152 etc.
  • Safety & Regulatory Standards: UL, CSA, IEC 62368-1, IEC 61010, IEC 60664, CE, EMC/EMI, RoHS, and REACH
Desired:
  • Experience supporting product certification, safety reviews, and regulatory compliance activities is preferred. .
Special:
  • CAM validation, check and basic editing of Gerber data using CAM350.
  • Strong leadership, communication, and problem-solving skills.
  • Ability to work effectively in cross-functional and global engineering environments.
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Relocation assistance provided