Lead Electronic Hardware Design Engineer

Trunexa Pvt. Ltd.; Navi Mumbai; On-site; INR 900,000 - 1,500,000; Full time

Job summary

Trunexa Pvt. Ltd. in Navi Mumbai is seeking a Lead Electronic Hardware Design Engineer to own the architecture and development of EV chargers, ticket validators, edge compute platforms and payment terminals.

You will take hardware from concept to certified, production-ready products, mentor junior engineers and collaborate with firmware, mechanical and compliance teams. The role covers high-speed PCB design, analog/digital power electronics, thermal management, EMI/EMC, and bringing boards from

Qualifications

• 7+ years hands-on hardware design experience.
• 2+ shipped, certified products in EV charging or embedded/edge domains.
• Strong command of analog, digital, power and mixed-signal PCB layout.
• Solid documentation, design calculations and verification practices.

Responsibilities

• Conceptualize and design hardware for EVSE, validators, edge compute devices and payment terminals.
• Lead design reviews and set standards for documentation and testing.
• Own schematic capture, PCB layout, bring-up, debugging and DFM/DFT.
• Ensure thermal design and certification readiness.

Skills

PCB design

Analog/digital design

Power electronics

High-speed interfaces

EMI/EMC testing

Mentoring

Education

B.Tech/M.Tech in Electrical/Electronics

Tools

Altium

OrCAD

Cadence

KiCad

Job description

Lead Electronic Hardware Design Engineer

About the Role:

We are looking for a Lead Electronic Hardware Design Engineer to own the architecture and development of our product portfolio: EV chargers (EVSE), ticket validators, edge compute platforms and payment terminals. You will take hardware from concept to certified, production-ready product, work closely with firmware, mechanical and compliance teams, and mentor junior engineers.

EVSE | Ticket Validator | Edge Compute | Payment Hardware

Roles and Responsibilities

• Product Innovation: Conceptualize, research and design hardware for EVSE (AC and DC fast charging), ticket validators, edge compute devices and payment terminals.
• Technical Leadership: Mentor engineers, run design reviews, and set standards for design, documentation and testing.
• EVSE and Power Electronics: Design control, metering, protection and communication boards, including pilot/CCS/CHAdeMO interfaces, isolation, contactor control and insulation monitoring.
• Edge Compute and Connectivity: Design SoM/SoC-based boards with high-speed interfaces (DDR, USB, SATA, Ethernet, PCIe, MIPI), LTE/Wi-Fi/BLE/NFC/GNSS modules and low-noise analog front ends.
• Payment and Validator Hardware: Integrate card readers (contact, contactless, magstripe), secure elements, tamper-detection circuits, displays and barcode/QR/NFC readers, with secure interfaces to the host processor.
• Execution: Own schematic capture, PCB layout (high-speed, mixed-signal, power, RF), board bring-up, debugging, DFM/DFT and handover to manufacturing.
• Thermal Design and Validation: Design for thermal efficiency from the start. Validate real board behavior using thermal imaging, sensor logging and chamber/soak testing. Find hotspots and root causes, and fix them through layout, components, copper/vias, heatsinking, airflow, enclosure changes and derating. Drive thermal sign-off against component limits and certification temperature-rise requirements.
• Certification Ownership: Define the compliance plan for each product type and design for it from day one. Work with labs and ODMs through pre-compliance, testing, failure analysis and final approval.
• Documentation: Maintain schematics, BOMs, design calculations, test and thermal reports, risk files and certification dossiers.

Desired Candidate Profile

• Education: B.Tech, M.Tech or PhD in Electrical/Electronics Engineering, Computer Engineering or equivalent.
• Experience: Minimum 7 years of hands-on hardware design, including at least 2 shipped, certified products in the EV charging, payment or embedded/edge domain.
• Technical Foundation: Strong command of analog, digital, power and microcontroller/microprocessor design, and of high-speed and mixed-signal PCB layout.
• Thermal Expertise: Proven ability to measure, diagnose and fix thermal problems on high-power or enclosed products, and to deliver verified fixes.
• Tools: Altium, OrCAD, Cadence, KiCad or equivalent; signal-integrity and thermal simulation tools (Icepak, Flotherm or equivalent).
• Personal Attributes: Problem-solving mindset, attention to detail, disciplined documentation, and comfort working with external labs, ODMs and vendors.

Certification Experience

Hands-on experience in at least two of the areas below is required; more is preferred.

Product

Certifications and Standards

Thermal Requirements

EVSE (AC/DC)

UL 2594, UL 2202, UL 2231, IEC 61851-1/-23, IEC 62196, CE/FCC, BIS/AIS-138, IS 17017, OCPP and ISO 15118 conformance, metering regulations

Temperature-rise testing, connector/cable temperature limits, over-temperature protection

Ticket Validator

FCC/CE/BIS EMC and radio, NFC (ISO 14443, EMVCo L1 contactless), transit standards, GMS (via ODM) if Android-based, IP/IK ratings

Operating temperature range, sunload, touchable surface limits

Edge Compute

FCC/CE/BIS EMC, IEC 62368-1, PTCRB/GCF, WPC/TEC, ESD/surge, vibration

Thermal throttling behavior, sustained full-load testing

Payment Terminal

EMVCo L1 (contact and contactless), PCI PTS POI, PCI PIN, tamper resistance, secure boot and key injection, card-brand approvals

Operating temperature range, touchable surface limits

Key Skills

• Design: Digital/analog/power PCB design, board bring-up, RF and antenna integration, microcontrollers/microprocessors, AC-DC, DC-DC and PFC, isolation, creepage and clearance, EMC-aware layout.
• Interfaces: UART, SPI, I2C, CAN, RS-485, Modbus, USB, Ethernet, NFC/RFID, cellular/Wi-Fi/BLE.
• Thermal: Copper pours, thermal vias, TIMs, heatsinks, airflow, power loss estimation, junction temperature calculation, thermal simulation, IR imaging, thermocouples, chamber testing and derating.
• Testing: Oscilloscopes, logic analyzers, spectrum and power analyzers, EMC pre-compliance, HALT/HASS, DVT/PVT, FMEA.

Good to Have

• Experience with ODMs and contract manufacturers.
• Firmware/Linux bring-up and secure boot familiarity.
• Experience with US, EU and India certification labs.
• Thermal failure analysis, and passing temperature-rise tests within one or two attempts.