Turn this role into an interview — a resume and cover letter built around what this employer wants.
Texas Instruments is building a world-class GaN Power Architect team in Bengaluru to design next-generation high-efficiency GaN power stage ICs. You will lead the full-stack execution from silicon architecture to bench validation of high-speed, high-voltage GaN gate drivers and integrated power stages.
You will bridge advanced GaN device physics with precision analog circuit design, driving breakthroughs in switching frequency, power density, and thermal performance.
At TI, we engineer the future — one silicon innovation at a time. Our power management portfolio powers everything from electric vehicles to data centers, and now we're doubling down on Gallium Nitride (GaN) — the technology redefining what's possible in high-efficiency power conversion.
We are assembling an elite team to design next-generation, high-efficiency GaN power stage ICs. As a GaN Power Architect, you will lead the full-stack execution — from silicon architecture to bench validation — of high-speed, high-voltage GaN gate drivers and integrated power stage building blocks.
You will be the critical bridge between advanced GaN semiconductor device physics and precision analog circuit design, driving breakthroughs in switching frequency, power density, and thermal performance.
Education & Experience: B.S., M.S., or Ph.D. in Electrical Engineering (or related) with 5+ years of hands-on analog/mixed-signal IC design experience in high-voltage or wide-bandgap (WBG) power management
Solid Analog Design Fundamentals — the kind that comes from doing, not just studying
GaN Driver Expertise: Proven track record designing high-speed, high-voltage gate drivers for GaN HEMTs (discrete or monolithically integrated)
GaN Device Physics: Deep understanding of V_th stability, gate degradation, Q_rr-equivalent loss mechanisms, dynamic R_DSon, and 2DEG physics
EDA Proficiency: Expert-level use of Cadence Virtuoso, Spectre/Spectre21, Calibre (DRC/LVS/PEX), and parasitic extraction workflows for high-frequency/high-power layouts
Lab & Debug Skills: Hands-on with high-bandwidth oscilloscopes, differential probes, and double-pulse testing setups
Working knowledge of switching converter topologies — multiphase buck, resonant LLC, boost, or active clamp flyback
Experience with ultra-low inductance power packaging — QFN, flip-chip, embedded dies, or multi-chip modules
Exposure to volume GaN manufacturing, DFT, and high-reliability applications