Job Posting Title Senior IC Substrate Package Layout Designer

MaxLinear, Inc.; Bengaluru; On-site; INR 1,800,000 - 3,000,000; Full time

Job summary

MaxLinear, Inc. in Bengaluru is seeking an experienced Senior IC Substrate Package Layout Designer to lead advanced semiconductor package development from die netlist analysis to production.

You will collaborate with Backend/Physical Design, SI/PI, Assembly, Reliability and Manufacturing to deliver high-performance package solutions for multi-die products, focusing on die bump planning, floorplanning, routing and signoff.

Qualifications

• Bachelor's or Master's in Electrical/Electronics Engineering or related field.
• 4+ years of IC package/substrate layout design experience.
• Expert-level proficiency in Cadence Allegro APD/APD XL, SiP Layout and Constraint Manager.
• Strong understanding of substrate stackups, HDI technologies, vias and reliability.
• Experience with high-speed interfaces such as SerDes, PCIe, DDR/LPDDR, HBM and Ethernet.

Responsibilities

• Own complete package design activities including die bump planning, pin assignment, floorplanning, package routing, stackup definition and package signoff.
• Perform bump feasibility studies and optimize package architecture for routability, SI/PI performance, manufacturability and reliability.
• Design substrates for FCCSP, HFCBGA/FCBGA, Leadframe, MCM, SiP, Interposer, Chiplet-based and 2.5D/3D packages.
• Collaborate with Backend, SI/PI, Thermal, Assembly, OSAT and substrate vendors to resolve design and manufacturing challenges.
• Support package verification, design reviews and tape-out activities while ensuring compliance with technology and assembly requirements.

Skills

Cadence Allegro APD

SiP Layout

Constraint Manager

HDI stackups

High-speed interfaces

Education

Bachelor's or Master's in Electrical/Electronics Engineering

Tools

Cadence APD/XL

Job description

Responsibilities

We are looking for an experienced Senior IC Substrate Package Layout Designer to lead advanced semiconductor package development from die netlist analysis, bump feasibility and package planning through substrate layout, SI/PI optimization, and manufacturing release. The role requires close collaboration with Backend/Physical Design, SI/PI, Assembly, Reliability, and Manufacturing teams to deliver high-performance package solutions for complex SoCs and multi-die products. You will focus on:

• Own complete package design activities including die bump planning, pin assignment, floorplanning, package routing, stackup definition, and package signoff
• Perform bump feasibility studies and optimize package architecture for routability, SI/PI performance, manufacturability, reliability, and cost
• Design and implement substrates for FCCSP, HFCBGA/FCBGA, Leadframe, Multi-Chip Modules (MCM), SiP, Interposer, Chiplet-based and advanced 2.5D/3D packages
• Collaborate closely with Backend, SI/PI, Thermal, Assembly, OSAT, and substrate vendors to resolve design and manufacturing challenges
• Support package verification, design reviews, and tape-out activities while ensuring compliance with technology and assembly requirements

Qualifications

• Bachelor's or Master's degree in Electrical/Electronics Engineering or related field
• 4+ years of experience in IC package/substrate layout design
• Expert-level proficiency in Cadence Allegro Package Designer (APD/APD XL), SiP Layout, and Constraint Manager
• Strong understanding of substrate stackups, material selection, HDI technologies, via structures, package assembly processes, and reliability considerations
• Working knowledge of Signal Integrity, Power Integrity, impedance control, differential routing, PDN design, return path optimization, and crosstalk management
• Hands‑on experience with high‑speed interfaces including SerDes, PAM4, PCIe, DDR/LPDDR, HBM, Ethernet, CXL, USB, UCIe, and other multi‑gigabit interfaces

Preferred Qualifications

• Experience with AI/HPC, Networking, Data Center, or High‑Performance Computing products
• Knowledge of advanced packaging technologies such as Chiplets, Silicon Interposers, CoWoS, EMIB, and 3D Integration
• Automation and scripting skills (Python, TCL, SKILL, or Perl)
• Proven ability to lead complex package programs and mentor junior designers

The ideal candidate should be capable of independently driving package design from concept to production while balancing performance, manufacturability, reliability, and cost objectives.