ISP Program Manager

Tata Electronics; Assam; On-site; INR 3,500,000 - 7,000,000; Full time

Job summary

Tata Electronics is seeking a Program Manager - OSAT to lead large, complex customer programs from concept through high-volume manufacturing. You will own end-to-end execution, integrating customer requirements with engineering, supply chain, and factory operations to ensure on-time, on-cost, and on-quality delivery.

The role emphasizes NPI to HVM readiness, including capacity planning and ramp management in an outsourced semiconductor environment.

Qualifications

• Bachelor’s degree in Engineering (Electrical, Mechanical, Materials, Industrial) or related field.
• 15+ years in semiconductor manufacturing, OSAT, or advanced packaging.
• Experience in program/project management with direct customer ownership.
• Experience with NPI and HVM ramp, and with assembly & test processes (wire bond, flip chip, WLCSP, BGA, SiP).
• Proven knowledge of manufacturing operations, capacity planning, yield management, and supply chain coordination.

Responsibilities

• Own end-to-end execution of multiple customer programs in OSAT.
• Interface between customers and internal teams (Technology Development, Factory NPI, Process Engineering, Operations, Quality, Supply Chain, Finance).
• Develop and maintain integrated program schedules, milestones, and deliverables.
• Drive program governance: stage gates, risk reviews, executive reporting.
• Manage program financials including cost optimisation, margins, and change management.

Skills

Program management

NPI & HVM

OSAT/semiconductor

Cross-functional leadership

Stakeholder management

Scheduling & governance

Cost modelling

Quality systems (APQP, FMEA)

Communication

Influence without authority

Education

Bachelor's in Engineering

Master's degree / MBA (preferred)

Job description

Job Description:

Role Overview

The Program Manager - OSAT is responsible for leading large, complex customer programs from concept through high-volume manufacturing. This role serves as the single point of accountability for program execution- integrating customer requirements, engineering development, supply chain, and factory operations to ensure on-time, on-cost, and on-quality delivery.

A major focus of this position is operations readiness for new products (NPI to HVM transition), including capacity planning, qualification, ramp management, and alignment of cross-functional teams within an outsourced semiconductor assembly and test environment.

Key Responsibilities

Program Leadership & Execution

• Own end-to-end execution of multiple customer programs within the OSAT business unit.
• Act as the primary interface between customers and internal organizations (Technology Development, Factory NPI and ProcessEngineering, Operations/Manufacturing, Quality, Supply Chain,andFinance).
• Develop and maintain integrated program schedules, milestones, and deliverables.
• Drive structured program governance: stage gates, risk reviews, and executive reporting.
• Manage program financials including cost optimisation models, margins, and change management.

Customer Engagement

• Lead customer technical and business reviews, ensuring alignment on scope, schedule, and performance.
• Translate customer requirements into actionable internal plans.
• Manage customer escalations and ensure rapid issue resolution.
• Support commercial teams in RFQs, SOWs, and new business opportunities.

Operations Readiness & NPI

• Lead NPI to HVM transition activities including:
  • Factory readiness (equipment, capacity, tooling, materials)
  • Qualification planning (DOE, reliability, process validation)
  • Yield ramp strategies and learning cycles
• Coordinate process development, product engineering, and manufacturing teams.
• Ensure BOM, process flows, test programs, and quality controls are production-ready.

Cross-Functional Coordination

• Chair core team meetings and drive accountability across functions.
• Manage risk registers, mitigation plans, and contingency strategies.
• Partner with Industrial Engineering on line design, cycletime, and capacity modeling.
• Align with Quality on customer qualifications, audits, and compliance.

Continuous Improvement

• Establish program management best practices, KPIs, and dashboards.
• Drive lessons-learned and standardization across programs.
• Support digitalization of program tracking and factory execution.

Required Qualifications

• Bachelor’s degree in Engineering (Electrical, Mechanical, Materials, Industrial) or related field.
• 15+ years of experience in semiconductor manufacturing, OSAT, or advanced packaging.
• Relevant years of experience in program/project management with direct customer ownership.
• Proven experience with:
  • New Product Introduction (NPI) and HVM ramp
  • Assembly & Test processes (wire bond, flip chip, WLCSP, BGA, SiP, etc.)
  • Semiconductor quality systems (APQP, FMEA, Control Plans, 8D)
• Strong knowledge of:
  • Manufacturing operations, capacity planning, and yield management
  • Supply chain coordination and material readiness
  • Cost modeling and program financial management
• Excellent stakeholder management and communication skills.
• Ability to influence cross-functional teams without direct authority.

Preferred Qualifications

• Master’s degree in Engineering, Operations, or MBA.
• Experience working directly in an OSAT or IDM ATM environment.
• PMP / PgMP / PRINCE2 certification.
• Hands-on background in:
  • Package development and reliability qualification
  • Test engineering and product bring-up
  • Factory automation and MES systems
  • Experience with Tier-1 global customers in mobile, automotive, HPC, or networking.
  • Six Sigma Green/Black Belt certification.