IN_RBAI_SMT Process Engineer_IN

Robert Bosch Group

Bengaluru

On-site

INR 900,000 - 1,300,000

Full time

2 days ago
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Job summary

Robert Bosch Group in Bengaluru, India, seeks an SMT Process Engineer to drive programming and optimization for SPP, SPI, P&P, Reflow, and AOI. You will standardize processes, lead continuous improvement, and collaborate with maintenance for preventive actions.

The role covers NPI reviews, DFM/DFA validation, and ensuring process capability. Candidates should have substantial SMT manufacturing and QA exposure in a high‑tech environment.

Qualifications

  • Diploma with 8 years of SMT manufacturing experience.
  • BE/B Tech with 6 years of SMT manufacturing experience.

Responsibilities

  • Develop, create, validate, and release machine programs for SPP, SPI, Pick & Place, Reflow, and AOI.
  • Optimize stencil, printing, placement, thermal profile, and inspection parameters to meet process targets.
  • Reduce cycle time, changeover time, and setup losses through continuous improvement.
  • Standardize program creation and validation across SMT equipment.
  • Define and maintain SOPs, work instructions, control plans, and process standards for SMT operations.
  • Monitor and audit process compliance and update documentation after changes.
  • Lead 8D, 5 Why, Fishbone, PFMEA to prevent recurrence of quality issues.
  • Drive preventive maintenance collaboration with maintenance teams.

Skills

SMT operation
Process engineering
Kaizen / Lean
HSE awareness

Education

Diploma in SMT manufacturing
BE/B Tech in SMT manufacturing

Tools

DFM/DFA analysis
AOI library creation

Job description

Company Description

In India, Bosch is a leading supplier of technology and services in the areas of Mobility Solutions, Industrial Technology, Consumer Goods, and Energy and Building Technology. Additionally, Bosch has in India the largest development center outside Germany, for end to end engineering and technology solutions. The Bosch Group operates in India through twelve companies with a combined strength of over 31,500 associates which includes around 15,650 research and development associates.

Bosch Automotive Electronics India Pvt. Ltd. (RBAI) is a 100% subsidiary of Robert Bosch GmbH . Established in 2009, in Naganathapura - Bengaluru, RBAI is primarily focused in manufacturing electronic products for the automotive sector. RBAI has consistently added an average of one product every year resulting in a wide range of products comprising – Engine Control Units (ECU) for both 4W and 2W, Body Control Modules (BCM), ECUs for ABS, DC-DC Converters, iTraMS (Intelligent communication control unit) to name a few. RBAI also produces products for eMobility like MCU (Motor control Unit), C-Box (Communication Box), VCUs (Vehicle Control Unit), Central gateway modules and is geared up for other futuristic products. RBAI with its diverse portfolio, not only caters to local markets, but also exports products to all major global customers. The Naganathapura Plant (NhP1) is seen as a benchmark in Operational Excellence in AE and Bosch India , using an integrated approach of Bosch Production System (BPS) and I4.0. With a young and agile team, RBAI’s mission statement ‘Be RBAI’ (Be Reliable Benchmark Agile Innovative) is a testament to our commitment in providing best in class products and services for its customers.

Job Description

SMT Process programming and optimization

  • 1.Develop, create, validate, and release machine programs for Solder Paste Printing (SPP), SPI, Pick & Place, Reflow Oven, and AOI.
  • 2.Optimize stencil, printing, placement, thermal profile, and inspection parameters to achieve process capability targets.
  • 3.Analyze and reduce cycle time, changeover time, and setup losses through continuous improvement initiatives.
  • 4.Standardize program creation and validation processes across all SMT equipment
  • 1.Define, implement, and maintain SOPs, work instructions, control plans, and process standards for SMT operations
  • 2.Establish control limits for paste height, volume, offset, placement accuracy, oven profile, and AOI criteria
  • 3.Monitor process compliance through periodic audits and process confirmations.
  • 4.Review and update process documentation based on lessons learned and engineering changes

Quality & Defect reduction

  • 1.Monitor and improve solder paste deposition quality through SPI data analysis.
  • 2.Analyze and eliminate SMT defects such as insufficient solder, excess solder, bridging, tombstone, skew, missing components, lifted leads, solder balls, and polarity errors.
  • 3.Validate solder joint quality through AOI and continuous defect trend monitoring
  • 4.Lead 8D, 5 Why, Fishbone, and PFMEA activities to prevent recurrence of quality issues

Machine Performance & Productivity Improvement

  • 1.Monitor SMT equipment utilization, downtime and throughput performance.
  • 2.Drive corrective actions for recurring machine stoppages and process interruptions.
  • 3.Coordinate with maintenance teams for preventive maintenance, calibration, and breakdown reduction.
  • 4.Implement predictive and preventive measures to improve machine reliability.

New Product Introduction (NPI)

  • 1.Review Gerber files, BOM, Pick and Place data, stencil design, and PCB layout for manufacturability.
  • 2.Conduct DFM/DFA reviews for SMT feasibility.
  • 3.Execute pilot builds, process validation, thermal profiling, and AOI library creation.
  • 4.Drive smooth product launch with optimized process settings from Day 1.

Process Engineering & Continuous Improvement

  • 1.Conduct cycle-time analysis and reduce bottlenecks in SMT line.
  • 2.Drive continuous improvement initiatives such as Kaizen, lean, and waste elimination.
  • 3.Improve CPH and utilization
  • 4.Implement Industry 4.0 and data-driven process monitoring solutions.

Training & Skill Development

  • 1.Train operators on SPP, SPI, Pick & Place, Reflow, and AOI operations.
  • 2. Conduct skill assessments, certification, and refresher training

HSE and Safety Compliance

  • 1. Ensure safe working conditions in SMT areas as per HSE standards
  • 2.Conduct HIRA and risk assessments for SMT equipment and processes
  • 3.Promote safe handling of solder paste, chemicals, and ESD- sensitive components.
Qualifications

Diploma - 8 years of SMT manufacturing experience, with strong exposure to SMT operation and process engineering

BE/B Tech- 6 years of SMT manufacturing experience, with strong exposure to SMT operation and process engineering

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