Hardware Engineer

Intel Corporation; Bengaluru; Hybrid; INR 2,500,000 - 4,000,000; Full time

Job summary

Intel Corporation in Bengaluru seeks a senior hardware engineer to own the schematic and layout execution for 100G/200G transceiver PCBA, from concept through EVT/DVT, ensuring PDN design and SI/PI requirements are met. You will maintain design documentation and drive early risk mitigation in a cross-disciplinary team.

The role requires Cadence-based design, high-density, multi-layer PCB work, and collaboration with mechanical, optical, firmware and test engineers to deliver reliable, high-speed

Qualifications

• Bachelor's degree with 6+ years of experience or Master's with 4+ years or PhD with 2+ in Electrical Engineering or similar STEM field.
• 3+ years of experience in HW/circuit design, Schematic design and Layout floor planning.
• Experienced in Cadence tools for schematic and layout.
• High density and high-speed multi-layer board design.
• Voltage regulator, microcontroller, DAC/ADC component selection, design and layout optimization.
• PCB and product bring up, lab optical and electrical measurement skills.
• High speed trace design and layout guidelines (25-50G NRZ, 100Gbps PAM4).
• Understand SPI, I2C, MDIO, CMIS interfaces for optical modules.

Responsibilities

• Own schematic and layout execution from concept to EVT/DVT phase of the product.
• Lead design reviews and present design summaries to management with mitigations for risks.
• Interface with mechanical, optical, firmware, process and test engineers.
• Coordinate with PI/SI engineers to simulate high-speed interfaces and RF traces.
• Ensure documentation, BOM specs, and tape-out readiness for NPI teams.

Skills

HW circuit design

Schematic design

Layout floorplanning

Cadence tools

High-speed PCB design

Power integrity

Microcontroller interfaces

SI/PI analysis

Signal integrity

Education

Bachelor's degree

Master's degree

PhD

Tools

PCB design tools

VNA/LCA equipment

Job description

Job Responsibilities

Support hardware design of an optical transceiver and evaluation boards meeting product specifications, including schematic capture, circuit simulation, PCB design guidance, DFM review and design verification testing Expertise in designing 100G/lane and 200G/lane module PCBA, own the schematic and layout execution, experience with designing PDN for high-speed DSP, RFICs, manage PI and SI requirements Experience with 100Gbps+ DSP, Driver, TIA, uControllers, DACs, ADCs, Voltage regulators, etc Key contributor to Product Requirements, Owns PCBA design from concept phase to full final design and EVT/DVT phase of the product. Understand electrical and optical requirements and specifications of optical transceiver MSA. Like 800G DR8/2xFR4, 1.6T DR8/2xFR4, 800G LPO, 1.6T LRO etc. Maintain documentation of a hardware design specification, Pass design check list prior to tape out, BOM specifications and work with NPI team to build PCBA. Lead design reviews and present design summary to management, highlight risks with mitigation plans. Interface and work collaboratively with mechanical engineers, optical engineers, Photonics engineer, firmware engineers, process engineers and test engineers. Design and coordinate with PI/SI engineers to simulate high-speed interfaces, RF traces, dc and ac PI analysis, etc. 100Gbps, 200Gbps NRZ and PAM4 signaling Interact with program manager, buyer/planner and suppliers to make sure designed parts are available in a timely manner for build. Troubleshooting and performance optimization of the sub-system/transceiver module board.

Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your degree, research and or relevant previous job and or internship experiences.

Required Skills

Bachelor's degree with 6+ years of experience or Masters degree 4+ years of experience or PHD with 2+ in Electrical Engineering or similar STEM field. 3+ years of experience in the following: HW/circuit design, Schematic design and Layout floor planning Experienced in Cadence tools for schematic and layout High density and high-speed multiple-layer board design. Voltage regulator, uController, DAC/ADCs component selection, design and layout optimization to meet product requirements PCB and product bring up, laboratory optical and electrical measurement skills. High speed Tline design and layout guidelines (25-50G NRZ, 100Gbps PAM4 and above) Understand principles of micro-controller and communication protocols such as SPI, I2C, MDIO, CMIS management interface for optical modules.

Preferred Skills

Experience working with high volume PCB/substrate fab houses. Selecting PCB stackup that meets product requirement. Experience with electronics CAD tools and modeling. Experience in PI and SI simulations is a plus. Knowledge of transceiver/test board electrical design principles, including module architecture, high speed signal integrity, crosstalk, power integrity, noise, soft start, ESD, FW, testing, etc. Experienced in layout and able to direct layout engineer with clear design priority Experience working with AWG, DCAM, VNA/LCA to characterize high speed performance. Strong communication and presentation skills.

Job Type

Experienced Hire

Shift

Shift 1 (India)

Primary Location

India, Bangalore

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION

Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter. Intel's official careers website.

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