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Kandou Technologies in Hyderabad seeks a Principal / Senior Staff embedded firmware engineer to define firmware architecture for high-speed SerDes and AI memory fabric. You will lead silicon bring-up, collaborate with ASIC design and signal integrity, and drive standards compliance for cutting-edge hardware.
Responsibilities include implementing link training for 100G and 200G lanes, owning FEC and telemetry pipelines, and coordinating with cross-functional teams.
We are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption.
Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-based AI memory fabric that is both scalable and energy-efficient. Unlike traditional interconnects, our solution reduces power consumption significantly while preserving high bandwidth and ultra-low latency — unlocking unprecedented efficiency for AI training and inference at scale.
Our architecture is not just an incremental improvement — it’s a foundational shift in how AI hardware is built for the future.
If this is the role you have been looking for and you want to be part of a growing Company, with an exciting future then we would really love to hear from you. Together We Kandou It!