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HCP Technologies Pvt. Ltd. in Bengaluru seeks a hands-on Field Services Engineer to install, commission and maintain complex capital equipment at customer sites.
You will work with IC decapsulation systems, wire and die bonders, LPCVD furnaces, and deposition systems, traveling across India to support clients. The role emphasizes on-site installation, calibration, preventive maintenance, training and high-quality service documentation.
HCP Technologies is a Bengaluru-based provider of advanced capital equipment for the Semiconductor, PCB/SMT, Electronics, 3D Printing, EV Battery, and Automotive industries — serving research and manufacturing clients across India.
We’re looking for a hands‑on Field Services Engineer to install, commission, and maintain equipment at customer sites, including IC decapsulation systems, wire bonders, die bonders, LPCVD furnaces, deposition systems etc.,