Engineer New Product Development (SMT)

Sl Lumax; Sriperumbudur; On-site; INR 900,000 - 1,300,000; Full time

Job summary

Sl Lumax in Tamil Nadu is seeking an SMT Process Engineer to lead NPI, pilot, and trial production on SMT lines, performing DFM, DFA and DFT reviews on new PCBA designs. You will set up stencil design, solder paste printing, 3D SPI, P&P setup, reflow profiling and 3D AOI.

Role requires strong root cause analysis skills, IPC-A-610, ISIR and IATF 16949/ISO 9001 adherence, plus cross-functional coordination with R&D, Component Engineering, Sourcing and Production to process ECNs and approve

Qualifications

• 5Why analysis and root cause investigation for defects during trials.
• Adherence to IPC-A-610 and IATF 16949 / ISO 9001 standards.
• Coordinate with R&D, Component Engineering, Sourcing and Production for ECNs.

Responsibilities

• Lead prototype, pilot and trial SMT production runs for new PCBA designs.
• Establish SMT parameters: stencil, solder paste, 3D SPI, pick-and-place, reflow, AOI.
• Design review pallets and fixtures for complex high-density designs.
• Prepare PFMEA, Process Flow, Control Plans and SOPs; ISIR documentation.

Skills

Root cause analysis

Statistical methods

Cross-functional coordination

Tools

Valor NPI

Circuit CAM

Gerber viewers

Job description

Role & responsibilities

• New Product Introduction (NPI): Lead prototype, pilot, and trial production runs on SMT lines. Perform DFM, DFA, and DFT reviews on new PCBA designs.
• Process Setup & Optimization: Establish SMT parameters (stencil design, solder paste printing, 3D SPI, Pick-and-Place setup, reflow profiling, and 3D AOI).
• Tooling & Jigs: Design review SMT selective soldering pallets, and reflow fixtures for complex, high-density designs.
• Quality & APQP: Prepare APQP documentation including PFMEA, Process Flow Charts, Control Plans, SOPs, and ISIR reports.

Defect Analysis & Root Cause:

• Execute 5Why problem-solving and root cause analysis for defects (tombstoning, bridging, voiding, shifting) during trial builds.
• Standards Compliance:
• Ensure strict adherence to IPC-A-610
• Class 3 criteria, ESD/EOS controls, and IATF 16949 / ISO 9001 standards.
• Cross-Functional Coordination:
• Work with R&D, Component Engineering, Sourcing, and Production teams to process ECNs and approve alternate components.

Preferred candidate profile

• Equipment Proficiency: Hands-on experience with high-speed SMT Pick & Place, Screen Printers, Reflow Ovens, 3D SPI, and 3D AOI systems.
• Software Tools: Working knowledge of Gerber viewers, CAD/CAM tools (Valor NPI or Circuit CAM).
• Standards: In-depth knowledge of IPC-A-610, IPC-7351, J-STD-020/033 (MSL handling), and ESD control (ANSI/ESD S20.20).
• Statistical Methods: Proficiency in SPC, yield tracking, and process capability analysis.