Electrical CM Support Engineer - Operations Engineering Team

Nokia; Bengaluru; On-site; INR 900,000 - 1,300,000; Full time

Benefits offered by this job

Flexible work arrangements

Health insurance

Maternity/Paternity leave

Career growth opportunities

Learning programs

Job summary

Nokia is seeking an Electrical CM Support Engineer in Bengaluru to drive advanced assembly and interconnect processes from NPI to volume manufacturing. You will optimize SMT and packaging, lead DOE studies, and perform root-cause analysis to ensure robust, high-quality products.

You will collaborate with design teams for DFM/ DFA and work with suppliers for reliability testing and production readiness, contributing to continuous improvement in a global connectivity leader.

Qualifications

• BS/MS/PhD in Electrical, Electronics, Manufacturing Engineering, Materials Science, or related field.
• Strong expertise in electronics manufacturing, SMT assembly, reflow soldering, thermal profiling, and advanced PCB technologies.
• Hands-on experience with advanced interconnect and packaging technologies (laser soldering, flip-chip, underfill, die attach).
• Proven capability in X-ray inspection, cross-section analysis, solder joint characterization, and failure/root-cause investigations.
• Experience with semiconductor packaging, silicon photonics, RF/optical modules, and Industry 4.0/automation.

Responsibilities

• Develop, optimize, and qualify SMT, through-hole, laser soldering, hot bar soldering, flip-chip, underfill, die attach, and advanced packaging processes.
• Define and maintain robust process windows for reflow soldering and advanced electronic assembly technologies.
• Support New Product Introduction (NPI) from prototype builds through high-volume manufacturing.
• Conduct process characterization, DOE, and process capability studies.
• Lead failure analysis and root-cause investigations using X-ray, cross-sectioning, microscopy, and electrical characterization.
• Drive yield improvement, quality enhancement, process optimization, and cost reduction initiatives.
• Collaborate with design teams to ensure DFM, DFA, and DFR.
• Develop manufacturing specifications, work instructions, control plans, process documentation, and qualification reports.
• Work closely with suppliers, contract manufacturers, and factory teams for reliability testing and production readiness.

Skills

SMT assembly

Reflow soldering

X-ray inspection

DOE

DFM/Design for Manufacturing

Advanced packaging

Failure analysis

Cross-section analysis

Packaging technologies

Electrical/Manufacturing engineering

Education

BS/MS/PhD in Electrical/Electronics/Manufacturing Engineering

Tools

SEM

EDS

FIB

Job description

Job Description

Join our Engineering Operations Team as an Electrical CM Support Engineer, where you will be responsible for developing, qualifying, and sustaining advanced assembly and interconnect processes used in high-performance electronic products. You will work across the entire product lifecycle, from New Product Introduction (NPI) through volume manufacturing, driving process optimization, yield improvement, and root cause analysis. In this role, you will support complex assembly technologies including SMT, fine-pitch PCBA, organic and mSAP-based substrates, reflow soldering, hot bar soldering, laser soldering, flip-chip assembly, and advanced packaging solutions. You will leverage inspection and analytical techniques such as X-ray analysis, cross-sectioning, microscopy, and reliability testing to ensure robust manufacturing processes and superior product quality. Our collaborative environment encourages innovation, technical leadership, and continuous improvement while solving challenging manufacturing problems.

NI Lightpath

How You Will Contribute And What You Will Learn

• Develop, optimize, and qualify SMT, through-hole, laser soldering, hot bar soldering, flip-chip, underfill, die attach, and advanced packaging processes.
• Define and maintain robust process windows for reflow soldering and advanced electronic assembly technologies.
• Support New Product Introduction (NPI) from prototype builds through high-volume manufacturing.
• Conduct process characterization, Design of Experiments (DOE), and process capability studies.
• Lead failure analysis and root-cause investigations using X-ray, cross-sectioning, microscopy, and electrical characterization.
• Perform cross-sectional analysis to assess solder joint integrity, PCB structures, and manufacturing defects.
• Drive yield improvement, quality enhancement, process optimization, and cost reduction initiatives.
• Collaborate with design teams to ensure Design for Manufacturing (DFM), Design for Assembly (DFA), and Design for Reliability (DFR).
• Develop manufacturing specifications, work instructions, control plans, process documentation, and qualification reports.
• Work closely with suppliers, contract manufacturers, and factory teams for reliability testing and production readiness.

Key Skills And Experience

• BS/MS/PhD in Electrical, Electronics, Manufacturing Engineering, Materials Science, or related field
• Strong expertise in electronics manufacturing, SMT assembly, reflow soldering, thermal profiling, and advanced PCB technologies.
• Hands-on experience with advanced interconnect and packaging technologies (laser soldering, flip-chip, underfill, die attach).
• Proven capability in X-ray inspection, cross-section analysis, solder joint characterization, and failure/root-cause investigations.
• Experience with semiconductor packaging, silicon photonics, RF/optical modules, advanced failure analysis techniques (e.g., SEM, EDS, FIB), and familiarity with Industry 4.0/automation.

About Us

Advancing connectivity to secure a brighter world.

Nokia is a global leader in connectivity for the AI era. With expertise across fixed, mobile and transport networks, powered by the innovation of Nokia Bell Labs, we’re advancing connectivity to secure a brighter world.

Learn more about life at Nokia .

Our recruitment process

We act inclusively and respect the uniqueness of people. Our employment decisions are made regardless of race, color, national or ethnic origin, religion, gender, sexual orientation, gender identity or expression, age, marital status, disability, protected veteran status or other characteristics protected by law. We are committed to a culture of inclusion built upon our core value of respect.

The length of the recruitment process may vary depending on the specific role's requirements. We strive to ensure a smooth and inclusive experience for all candidates. Discover more about the recruitment process at Nokia .

About The Team

Some of our benefits in India:

• Flexible and hybrid working arrangements to support work–life balance
• Health and well-being support – medical insurance for you and your family, health check-ups, life and accident insurance, well-being programs, and employee resource groups
• A minimum of 90 days of Maternity and Paternity Leave based on eligibility
• Personal Support Service 24/7 – a confidential support channel open to all Nokia employees and their families in challenging situations
• Career growth & mobility – technical career paths, job rotations, international assignments, and relocation support
• Continuous learning – technical certifications, mentoring programs, coaching, and digital learning platforms
• Opportunities to innovate and contribute through Nokia’s research and development environment
• Recognition programs that celebrate outstanding contributions
• Workplace support – ergonomic working support and mobile device programs based on eligibility