CPU PDN & EM/IR Sign-Off Engineer (Lead/Staff)

Qualcomm

Bengaluru

On-site

INR 1,200,000 - 2,100,000

Full time

14 days+
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Job summary

Qualcomm India Private Limited is seeking a Hardware Engineer to design, verify and test electronic systems including PDN, IR and power integrity for high‑performance CPU/DSP blocks. You will work with cross‑functional teams on Bump planning, RDL routing and power delivery optimization.

Candidates should have 4+ years in hardware engineering or related fields, with strong PDN and signoff experience and proficiency in scripting (Tcl/Perl).

Qualifications

  • Bachelors in Electronics or related field with 4+ years hardware engineering experience or equivalent.
  • Masters with 3+ years or PhD with 2+ years experience in hardware engineering.
  • Strong background in PDN/PDN signoff concepts and SoC/IPO environments.

Responsibilities

  • IR Signoff CPU/high performance cores.
  • Signal EM & Power EM Signoff for Chip TOP/Block levels.
  • Develop PG Grid specs for different HM.
  • Validate PG Grid through Grid/Power checks.
  • Validate IR Drops using IR/Voltage checks for Die & Package.
  • Collaborate on Bumps/RDL routing with SOC and Packaging teams.
  • Partner with CAD teams to improve automation flows.

Skills

PDN Signoff
Power Integrity
Scripting Tcl
Scripting Perl
Innovus
RDL/Bump Planning
PDN/IR Signoff Tools
LDK/EDA tools
Communication
LSF/Compute optimization

Education

Bachelors - Electronics Engineering
Bachelor’s degree in CS / Electrical / Electronics
PhD in CS / Electrical / Engineering

Tools

Redhawk
Redhawk_SC
Voltus
Innovus/Fusion Compiler

Job description

Company

Qualcomm India Private Limited

Job Area

Engineering Group, Engineering Group > Hardware Engineering

General Summary

As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements.

Minimum Qualifications
  • • Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience.
Job Description
  • IR Signoff CPU/high performance cores
  • Signal EM & Power EM Signoff for Chip TOP level & Block level CPU/DSP and other HM’s
  • Development of PG Grid spec for different HM
  • Validating the PG Grid using Grid Resistance & Secondary PG Resistance Checks
  • Validating the IR Drops using Static IR , Dynamic IR Vless & VCD Checks for validating Die & Pkg Components of IR Drops.
  • Experience in IO, Bump planning and RDL routing Strategy.
  • Working with SOC and Packaging Teams on Bumps Assignments / RDL Enablement / Pkg Routing Optimizations to improve overall PDN Design.
  • Partnering with EDA tool vendors and internal CAD teams to develop and enhance automation flows and methodologies for improving design efficiency.
  • Good knowledge on PD would is desirable.
  • Python , Perl , TCL.
Skill Set
  • Hands on experience in PDN Signoff using Redhawk / RHSC / Voltus at block level / SOC Level.
  • Good understanding on Power Integrity Signoff Checks.
  • Proficient in scripting languages (Tcl and Perl).
  • Familiarity with Innovus for RDL / Bump Planning/PG eco.
  • Ability to communicate effectively with multiple global cross-functional teams.
  • Tools : Redhawk , Redhawk_SC and basic use case of Innovus/ Fusion Compiler
  • Power Planning/Floorplanning ,Physical Verification hands on experience is added advantage.
  • LSF /compute optimization understanding.
Minimum Qualifications
Education
  • * Bachelors - Electronics Engineering
Work Experiences
  • * Years of experience : 4 to 10 years of realavant experience
Applicants

Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

Policy

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

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