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TYLsemi is seeking an Analog Design Engineer to design high-performance analog and mixed-signal circuits for scalable AI hardware. The role spans a wide experience range (5–30 years) and requires translating system requirements into silicon-ready designs while validating performance across corners and collaborating across layout, verification, test, and product teams.
The candidate will lead the design of voltage regulators, PMICs, and power delivery blocks, leveraging Cadence Virtuoso, Spectre,
The AI infrastructure market is exploding. Every hyperscaler, every cloud provider, every AI company is building custom silicon. But they all face the same problem:how do you connect hundreds of chips, deliver clean power at scale, and move terabits of data without melting the package?
That's what we solve. TYLsemi builds thechiplet infrastructure IP— the IO, power delivery, and interconnect building blocks — that makes AI/HPC systems actually work at scale.
This isn't a nice-to-have. It's the critical path.
Translation:We’re entering the market at exactly the moment when every major AI/HPC player needs what we’re building, and their alternatives are disappearing.
There are no layers, no approval chains, no corporate theater.
We’re not a research project. We have paying customers, committed capital, and aggressive timelines.
This is a company, not a lifestyle business. We’re building to win.
Here’s why you should:
This is the bet. Join us and build something that matters.
Or stay comfortable. No judgment.
But if you’re the kind of person who wants to take the shot, we’d love to talk.
As a Analog Design Engineer atTYLsemi, you will design and deliver high-performance analog and mixed-signal circuits that enable robust, manufacturable silicon. This role spans a wide experience range (5–30 years) and is ideal for engineers who combine strong fundamentals with practical execution—translating system requirements into silicon-ready designs, validating performance across corners, and partnering closely with layout, verification, test, and product teams to drive first-time-right outcomes.
WhatYou’llDo
Designof Voltage Regulatorsincludinghigh-efficiency power stages,error amplifiers, current sensing, adaptive load-line circuits, fast transient compensation,protectionand telemetry.Modeling ofmixed-signal subsystemsincludingRegulatorcontrol loops,Power delivery network, DVFS subsystemsetc.to guide architectureand designtrade-offs Lead the collaborationwith SIPI/PI, packagingteams to co-optimizeVRand power delivery.
WhatWe’reLookingFor
8+ years of hands-on analog/mixed-signal IC design experience with a strong focus on high-current, high-efficiency Power management (PMIC / IVR / DC-DC converters).Deepexpertisein different voltage regulator topologiesincluding control loopsdelivering large currentat high switching frequencies.Hands-on experience in magnetics integration for high-density IVR— including inductor modeling, coupling effects, EMI/thermal co-optimization, and 3DIC package integration.Proficiencywith industry-standarddesign and modellingtoolsincludingCadence Virtuoso,Spectre, Clarity/EMX, MATLAB/Simulink.Experience in2.5D,packagingflowsand co-design with SIPI/PDN teams.Team player with excellent communication skillsBS/ MS / PhD in Electrical Engineering (Analog & Mixed-Signal focus)
Experience withstate-of-the-advantage-in AI/HPCpower delivery.Experience in designing power management switching regulators, including Buck, Boost, Buck-Boost, LDO, and other PMIC building blocks. Strong background in power management circuits such as LDOs, bandgap references, voltage/current references, protection circuits, start-up circuits, transient response optimization, and related analog power management functions.Familiarity with advanced packagingflowand thermal/PI co-optimization
Analog blocks meet spec with margin across PVT, mismatch, and post-layout effectsDesign reviews are crisp: requirements, tradeoffs, and risks are clearly articulated and managedSiliconbring-up converges quickly through strong correlation, structured debug, and decisive fixesCross-functional partners (layout, verification, test, validation) can execute efficiently with clear interfaces and documentation Reusable design collateral and improvedmethodologyreduce cycle time and increase first-pass success