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TYLsemi, Inc. is seeking an experienced Analog Design Engineer to design and deliver high-performance analog and mixed-signal circuits for robust silicon.
This role spans a wide experience range (5–30 years) and requires translating system requirements into silicon-ready designs, validating performance across corners, and partnering with layout, verification, test, and product teams to drive first-time-right outcomes.
About TYLsemi, Inc.
About TYLsemi, Inc.
The AI infrastructure market is exploding. Every hyperscaler, every cloud provider, every AI company is building custom silicon. But they all face the same problem: how do you connect hundreds of chips, deliver clean power at scale, and move terabits of data without melting the package?
That's what we solve. TYLsemi builds the chiplet infrastructure IP— the IO, power delivery, and interconnect building blocks — that makes AI/HPC systems actually work at scale.
This isn't a nice-to-have. It's the critical path.
The semiconductor industry is going through its biggest architectural shift in 40 years:
No Politics, No Bureaucracy
There are no layers, no approval chains, no corporate theater.
We're not a research project. We have paying customers, committed capital, and aggressive timelines.
This is a company, not a lifestyle business. We're building to win.
If you're reading this, you're probably comfortable. You have a good job at a stable company with all the benefits.
We're asking you to walk away from that and bet on us.
Here's why you should:
This is the bet.Join us and build something that matters.
Or stay comfortable. No judgment.
But if you're the kind of person who wants to take the shot, we'd love to talk.
As a Analog Design Engineer at TYLsemi, you will design and deliver high-performance analog and mixed-signal circuits that enable robust, manufacturable silicon. This role spans a wide experience range (5–30 years) and is ideal for engineers who combine strong fundamentals with practical execution—translating system requirements into silicon-ready designs, validating performance across corners, and partnering closely with layout, verification, test, and product teams to drive first-time-right outcomes.
Design of Voltage Regulators including high-efficiency power stages, error amplifiers, current sensing, adaptive load-line circuits, fast transient compensation, protection and telemetry. Modeling of mixed-signal subsystems including Regulator control loops, Power delivery network, DVFS subsystems etc. to guide architecture and design trade-offs. Lead the collaboration with SIPI/PI, packaging teams to co-optimize VR and power delivery.
8+ years of hands-on analog/mixed-signal IC design experience with a strong focus on high-current, high-efficiency Power management (PMIC / IVR / DC-DC converters). Deep expertise in different voltage regulator topologies including control loops delivering large current at high switching frequencies. Hands-on experience in magnetics integration for high-density IVR— including inductor modeling, coupling effects, EMI/thermal co-optimization, and 3DIC package integration. Proficiency with industry-standard design and modelling tools including Cadence Virtuoso, Spectre, Clarity/EMX, MATLAB/Simulink. Experience in 2.5D, packaging flows and co-design with SIPI/PDN teams. Team player with excellent communication skills. BS/ MS / PhD in Electrical Engineering (Analog & Mixed-Signal focus).
Experience with state-of-the-art AI/HPC power delivery. Experience in designing power management switching regulators, including Buck, Boost, Buck-Boost, LDO, and other PMIC building blocks. Strong background in power management circuits such as LDOs, bandgap references, voltage/current references, protection circuits, start-up circuits, transient response optimization, and related analog power management functions. Familiarity with advanced packaging flow and thermal/PI co-optimization.
Analog blocks meet spec with margin across PVT, mismatch, and post-layout effects. Design reviews are crisp: requirements, tradeoffs, and risks are clearly articulated and managed. Silicon bring-up converges quickly through strong correlation, structured debug, and decisive fixes. Cross-functional partners (layout, verification, test, validation) can execute efficiently with clear interfaces and documentation. Reusable design collateral and improved methodology reduce cycle time and increase first-pass success.