Memory & Die-to-Die Systems Engineer (Mixed-Signal IP)

QUALCOMM, Inc.; Cork; On-site; EUR 90,000 - 130,000; Full time

Benefits offered by this job

Salary and stock bonus

Maternity/Paternity Leave

Employee stock purchase plan

Relocation assistance

Insurance benefits

Job summary

Qualcomm Ireland Cork is seeking Memory and Die-to-Die Systems Engineers to join our Mixed-Signal IP team. You will help architect, model, analyze, and optimize LPDDR, DDR, HBM, and Die-to-Die interconnects across advanced process technologies, interfacing with PHY, controller, package, silicon and platform teams.

You will develop behavioral and electrical models, evaluate performance under realistic workloads, and contribute to system-level validation from concept to silicon bring-up in a

Qualifications

• Experience in high-speed memory interfaces, chip-to-chip communication systems, SerDes, or related technologies.
• Strong understanding of signal integrity, power integrity, and high-speed system design principles.
• Experience developing behavioural, architectural, or electrical models using MATLAB, Python, SystemC, Verilog-AMS, or similar environments.
• Knowledge of DDR/LPDDR, HBM, UCIe, PCIe, CXL, or related industry technologies is highly desirable.
• Experience with SPICE simulation tools and electrical modelling workflows.

Responsibilities

• System Architecture & Definition: Define architectures for memory and Die-to-Die communication systems and analyze trade-offs.
• System Modelling & Analysis: Develop behavioural and electrical models and create simulation environments.
• Signal Integrity & Power Integrity: Drive SI/PI analysis and optimize channel characteristics and PDN.
• Technology & Silicon Development: Investigate impact of advanced tech nodes and packaging on performance.
• Cross-Functional Collaboration: Partner with analog, digital, firmware, package, product engineering and validation teams.

Skills

High-speed interfaces

Chip-to-chip

Signal integrity

Power integrity

System design principles

MATLAB

Python

SystemC

Verilog-AMS

DDR/LPDDR/HBM/UCIe/PCIe/CXL

SPICE

Education

Master's or Ph.D. in Electrical/Electronic/Computer Engineering or Physics

Bachelor's degree in Electrical/Computer Engineering, Physics, or related field

Tools

SPICE tools

Verilog-AMS

SystemC

MATLAB

Python

Job description

Qualcomm Ireland Cork is seeking Memory and Die-to-Die Systems Engineers to join our Mixed-Signal IP team. You will help architect, model, analyze, and optimize LPDDR, DDR, HBM, and Die-to-Die interconnects across advanced process technologies, interfacing with PHY, controller, package, silicon and platform teams.

You will develop behavioral and electrical models, evaluate performance under realistic workloads, and contribute to system-level validation from concept to silicon bring-up in a