Principal Engineer, Advanced Packaging (TGV/TSV)

ASTRI - Hong Kong Applied Science and Technology Research Institute; Hong Kong; On-site; HKD 900,000 - 1,200,000; Full time

Benefits offered by this job

Paid leave

Medical insurance

MPF contribution

Five‑day work week

Job summary

The Hong Kong Applied Science and Technology Research Institute (ASTRI) invites an experienced engineer to lead advanced package process development, including TGV and TSV applications, and to collaborate with product design and materials teams. The role emphasizes delivering robust process windows for prototypes and field support.

Candidates should have a Bachelor's degree or higher in engineering, 10+ years in packaging, and strong communication skills.

Qualifications

• Bachelor's degree or above in Mechanical Engineering, Materials Engineering, Chemical Engineering, or related disciplines.
• 10+ years experience in advanced packaging and process development; less experience will be considered as Associate Principal Engineer.
• Expertise in panel level and wafer level process development (e.g., chemical etching, electroplating for TGV and/or TSV applications) will be a big plus.
• Good communication and interpersonal skills, a good team player.
• Live the ASTRI values.

Responsibilities

• Responsible for advanced package process development, including etching, electroplating, thinning, 3D stacking, dicing, etc. for TGV (through‑glass‑via) and/or TSV (through‑silicon‑via) related applications.
• Work with product design and material development teams to develop optimal process window for engineering prototype build.
• Transfer technical solution to the customer and provide on‑site technical support.
• Perform ad hoc duties as assigned.

Skills

Advanced packaging

Process development

Wafer/panel level methods

Technical leadership

Education

Bachelor's degree or above in Mechanical Engineering, Materials Engineering, Chemical Engineering, or related disciplines

Job description

The Hong Kong Applied Science and Technology Research Institute (ASTRI) invites an experienced engineer to lead advanced package process development, including TGV and TSV applications, and to collaborate with product design and materials teams. The role emphasizes delivering robust process windows for prototypes and field support.

Candidates should have a Bachelor's degree or higher in engineering, 10+ years in packaging, and strong communication skills.