Senior Process Development Engineer: Next-Gen Modules

Apple Inc.; Hong Kong; On-site; HKD 900,000 - 1,300,000; Full time

Job summary

Apple Inc. in Hong Kong seeks a senior Process Development professional to design and evaluate new processes for next-generation modules within Apple’s ecosystem.

You will establish baseline processes, define CTQ metrics and work with vendors to develop new equipment, presenting findings to cross-functional teams. The role emphasizes proof-of-concept studies, DOEs, and rigorous metrology to assure manufacturability and product quality across advanced assembly processes such as flip chip, wire

Qualifications

• Degree of Science in Engineering or equivalent.
• Minimum 15 years of experience in doing process R&D.
• Clear and effective written and communication skills.
• Hands-on experience in various module assembly processes such as flip chip, flex attach, pick and place, glue dispensing, wire bonding, filling, laser soldering, component cleaning, curing, plating, singulation, wafer bonding.

Responsibilities

• Work on process equipment to conduct proof of concept evaluation and DOEs.
• Establishment of baseline process and CTQ metrics.
• Perform process characterization.
• Establish design guidelines for manufacturability.
• Define procedures and metrologies for CTQ measurements.
• Generate engineering report based on studies and evaluation.
• Reporting of engineering studies and providing recommendations based on engineering assessment to cross-functional teams.

Skills

Process R&D

DOE

CTQ metrics

Metrology

Cross-functional

Communication

Education

BSc in Engineering/Science

Tools

JMP

Minitab

Job description

Apple Inc. in Hong Kong seeks a senior Process Development professional to design and evaluate new processes for next-generation modules within Apple’s ecosystem.

You will establish baseline processes, define CTQ metrics and work with vendors to develop new equipment, presenting findings to cross-functional teams. The role emphasizes proof-of-concept studies, DOEs, and rigorous metrology to assure manufacturability and product quality across advanced assembly processes such as flip chip, wire