Senior Packaging Engineer - TSV/TGV Specialist

ASTRI - Hong Kong Applied Science and Technology Research Institute; Hong Kong; On-site; HKD 300,000 - 450,000; Full time

Benefits offered by this job

Paid leave

Medical insurance coverage

Contribution to MPF

Job summary

ASTRI, based in Hong Kong, is looking for a professional to lead advanced package process development related to TGV and TSV applications. The role involves working closely with product design teams and providing technical support to customers.

The ideal candidate holds a Bachelor's degree in Mechanical, Material or Chemical Engineering and possesses at least 2 years of experience in process development. ASTRI offers a competitive salary and benefits including paid leave and medical insurance.

Qualifications

• 2+ years experience in advanced packaging and process development.
• Less experience will be considered as Engineer.
• Live the ASTRI values.

Responsibilities

• Responsible for advanced package process development including etching and electroplating.
• Work with teams to develop optimal process window for prototypes.
• Transfer solutions to customers and provide on-site support.
• Perform ad hoc duties as assigned.

Skills

Communication skills

Interpersonal skills

Team player

Education

Bachelor's degree in Mechanical Engineering

Bachelor's degree in Material Engineering

Bachelor's degree in Chemical Engineering

Job description

ASTRI, based in Hong Kong, is looking for a professional to lead advanced package process development related to TGV and TSV applications. The role involves working closely with product design teams and providing technical support to customers.

The ideal candidate holds a Bachelor's degree in Mechanical, Material or Chemical Engineering and possesses at least 2 years of experience in process development. ASTRI offers a competitive salary and benefits including paid leave and medical insurance.