Power Packaging R&D Engineer

MPS Chengdu; Hong Kong; On-site; HKD 1,000,000 - 1,400,000; Full time

Job summary

Monolithic Power Systems, Inc. in Hong Kong seeks a senior packaging engineer to develop new package types and structures for next‑gen power electronics. You will translate material and design requirements into robust packaging solutions, leading roadmaps and collaboration with suppliers.

The ideal candidate holds a Doctor's degree in a related field, speaks fluent English, and is experienced with package development principles; knowledge of AutoCAD or Cadence is a plus.

Qualifications

• Package or Power Electronics major with deep knowledge of package development principles.
• Doctor's degree required.
• Fluent in spoken and written English.
• Familiar with AutoCAD or Cadence software is a plus.

Responsibilities

• Survey new material to meet new package processes, reliability, and cost requirements.
• Collect packaging information/requirement from TME/DE/Marketing/Competitor for next generation package development.
• Sum up the experience of package design & process, and maintain package design rules & update package road map.
• Perform other tasks assigned by supervisor.

Skills

Fluent English

Education

Doctor's degree

Package or Power Electronics Major

Tools

AutoCAD

Cadence

Job description

Monolithic Power Systems, Inc. in Hong Kong seeks a senior packaging engineer to develop new package types and structures for next‑gen power electronics. You will translate material and design requirements into robust packaging solutions, leading roadmaps and collaboration with suppliers.

The ideal candidate holds a Doctor's degree in a related field, speaks fluent English, and is experienced with package development principles; knowledge of AutoCAD or Cadence is a plus.